Micro LED Mass Transfer Assembly With Intermediate Substrate Alignment
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Solution Overview
Problem
The challenge of transferring micro LED elements from a growth substrate to a driving substrate at one time is hindered by the need to manage small distances between adjacent elements, leading to increased workload and cost.
Innovation Solution
A mass transfer assembly using a temporary substrate and a transfer substrate with adhesion regions to suspend and align micro LED elements, allowing for simultaneous transfer to binding regions on the driving substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the distance between two adjacent micro LED elements on the growth substrate is reduced to improve substrate utilization rate, then the substrate utilization rate is improved, but the elements cannot be transferred to the driving substrate at one time, resulting in increased workload and transfer cost
Solution Approach 1:
The invention introduces an intermediate transfer substrate that segments the transfer process into two stages: first from growth substrate to transfer substrate, then from transfer substrate to driving substrate. This segmentation allows dense packing on the growth substrate while enabling manageable transfer operations through the intermediate substrate, resolving the contradiction between high substrate utilization and transfer efficiency.
Solution Approach 2:
The transfer substrate serves as an intermediary carrier between the growth substrate and the driving substrate. It temporarily holds the micro LED elements in a suspended state with electrodes accessible, facilitating the transfer process without requiring direct contact between growth and driving substrates, thus enabling efficient bulk transfer while maintaining high density.
2Quantity of substance
If the distance between two adjacent micro LED elements on the growth substrate is reduced, then more elements can be accommodated on the substrate, but the elements cannot be transferred to the driving substrate at one time, leading to increased workload
Solution Approach 1:
By segmenting the transfer process through an intermediate substrate, the system can accommodate high element density on the growth substrate while breaking down the complex transfer operation into manageable stages, reducing overall process complexity despite the large number of elements.
Solution Approach 2:
The transfer substrate acts as a mediator that simplifies the transfer of densely packed elements by providing an intermediate holding position where elements are suspended with accessible electrodes, making the transfer process less complex than direct substrate-to-substrate transfer would require.
3Quantity of substance
If the distance between two adjacent micro LED elements on the growth substrate is reduced, then substrate utilization is improved, but the transfer cost increases due to multiple transfer operations
Solution Approach 1:
The segmented transfer approach through an intermediate substrate actually reduces overall transfer cost by enabling bulk transfer operations at each stage rather than requiring multiple individual element transfers, thus maintaining cost-effectiveness while achieving high substrate utilization.
Solution Approach 2:
The transfer substrate as an intermediary enables efficient bulk transfer operations that reduce the total number of transfer steps required, thereby lowering manufacturing cost while allowing high-density element placement on the growth substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient transfer of micro LED elements in bulk, reducing workload and cost by aligning and binding them to the driving substrate in a one-to-one correspondence, thereby improving the utilization rate of the growth substrate.
Implementation Method 1
The temporary substrate is configured to adhere two electrodes of each of a plurality of light-emitting elements on the growth substrate, to separate the plurality of light-emitting elements from the growth substrate
Implementation Method 2
The transfer substrate is configured to adhere, through the adhesion regions, a light-emitting body of each of a plurality of light-emitting elements on the temporary substrate, to separate the plurality of light-emitting elements from the temporary substrate
Data Source
AI summary
A mass transfer assembly includes a temporary substrate and a transfer substrate. The temporary substrate is configured to adhere electrodes of each light-emitting element on a growth substrate, to separate each light-emitting element from the growth substrate, such that a light-emitting body of each light-emitting element is suspended. The transfer substrate is configured to adhere, through adhesion regions, a light-emitting body of each light-emitting element on the temporary substrate, to separate each light-emitting element from the temporary substrate, such that electrodes of each light-emitting element are suspended. One adhesion region adheres a light-emitting body of one light-emitting element. Positions of the adhesion regions on the transfer substrate are in one-to-one correspondence with positions of binding regions on a driving substrate. The transfer substrate is further configured to transfer each light-emitting element to the driving substrate, to bind electrodes of each light-emitting element to a corresponding binding region.