Micro LED Chip Transfer Structure to Prevent Backplane Wire Damage
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Solution Overview
Problem
During the transfer process of Micro Light Emitting Diode (Micro LED) chips from the growth substrate to the driving backplane, the laser used to strip off the growth substrate often damages the wires on the driving backplane, leading to abnormal display panel performance.
Innovation Solution
A method involving the formation of a transfer film layer with an electrode fixing structure and through-wire holes, allowing the light emitting chip to be transferred without direct laser exposure to the driving backplane, and connecting wires through these holes to establish electrical connections, thereby avoiding damage to the binding-point electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser is used to strip off the growth substrate, then the light emitting chip can be transferred to the driving backplane, but the wires on the driving backplane are easily broken by the laser
Solution Approach 1:
The patent divides the transfer process into two separate stages: first transferring the light emitting chip to a temporary substrate, then transferring from the temporary substrate to the driving backplane. This segmentation allows the laser stripping to occur away from the driving backplane, protecting the wires while maintaining transfer efficiency
Solution Approach 2:
The patent introduces a temporary substrate as an intermediary carrier between the growth substrate and the driving backplane. This temporary substrate absorbs the laser impact during the stripping process, preventing direct damage to the driving backplane wires while enabling successful chip transfer
2Ease of manufacture
If the growth substrate is stripped off using laser, then the light emitting chip can be released, but the binding-point electrodes on the driving backplane are damaged
Solution Approach 1:
The patent performs the preliminary action of transferring the chip to a temporary substrate before the final transfer to the driving backplane. This preliminary transfer positions the chip for subsequent electrode connection without exposing the driving backplane electrodes to laser damage during the stripping process
Solution Approach 2:
The temporary substrate serves as a protective intermediary during the laser stripping process, shielding the driving backplane electrodes from direct laser exposure while still allowing the chip release to proceed effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the risk of wire breakage on the driving backplane, ensuring stable connections and normal display panel performance by isolating the stripping process from the electrical connections and using a supporting structure to prevent chip collapse.
Implementation Method 1
the growth substrate needs to be removed by means of stripping off using the laser
Data Source
AI summary
A method includes forming a light emitting chip on a surface of a growth substrate; forming a transfer film layer on a transient substrate; forming an electrode fixing structure on a side of the transfer film layer away from the transient substrate, and opening a through-wire hole in the transfer film layer adjacent to the electrode fixing structure; making the growth substrate opposite to the transient substrate; making the light emitting transfer structure opposite to a driving backplane; and forming a connection wire, a portion of the connection wire is connected to the binding-point electrode through the through-wire hole, and another portion of the connection wire is connected to the electrode fixing structure.