Micro LED Transfer Docking for Display Manufacturing
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Solution Overview
Problem
The conventional manufacturing process of micro LED displays is challenging due to the difficulty in precisely picking and aligning millions of small LED devices with different emission colors, resulting in high costs, long manufacturing times, and low yield rates.
Innovation Solution
A method involving multiple transfer platforms with bonding layers is used to accurately and quickly arrange light emitting devices of different colors on a back plate by docking the platforms to the back plate in a way that avoids collisions, allowing for the transfer of a predetermined number of devices in each docking step, reducing alignment needs and increasing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional picking and aligning process is used for LED devices, then individual LED devices can be placed on the back plate, but the manufacturing cost is high, manufacturing time is long, and yield rate is low due to difficulty in precise alignment of millions of small LED devices
Solution Approach 1:
The back plate is divided into multiple docking positions, and LED devices are transferred in batches to different positions through multiple docking operations. This segmentation allows parallel processing of different regions, significantly improving manufacturing efficiency while maintaining precision through controlled docking at each position.
Solution Approach 2:
LED devices are pre-arranged on transfer platforms in the correct patterns before docking. The transfer platforms are prepared in advance with LED devices positioned according to the final display pattern, eliminating the need for individual picking and alignment during the main manufacturing process.
2Productivity
If multiple transfer platforms are used for batch transfer of LED devices, then manufacturing efficiency is improved, but the complexity of the docking process increases
Solution Approach 1:
Multiple transfer platforms are designed with identical structures and functions, each capable of holding and transferring LED devices to specific docking positions. This universality simplifies the overall system design compared to customizing each transfer mechanism, as the same platform design can be replicated and used for different color regions.
Solution Approach 2:
The transfer platforms serve as intermediary carriers between the LED device array and the final display positions on the back plate. These intermediaries simplify the transfer process by providing a stable, pre-positioned platform that can be docked precisely to the back plate, reducing the complexity of direct placement mechanisms.
3Manufacturing precision
If LED devices are transferred in multiple batches to different docking positions, then alignment errors and collisions are minimized, but the number of docking operations increases
Solution Approach 1:
The transfer process is segmented into multiple docking operations, each handling a specific region or color of LED devices. This segmentation allows each docking operation to focus on a smaller, more manageable set of devices, improving alignment accuracy while the parallel nature of multiple platforms reduces the total time penalty.
Solution Approach 2:
The docking process uses periodic, sequential operations where transfer platforms are docked in a predetermined sequence to different positions on the back plate. This periodic action allows for systematic control of the transfer process, ensuring that each docking operation is optimized for its specific position while maintaining overall efficiency through the repeating pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the rapid and precise arrangement of light emitting devices, lowering manufacturing costs and increasing yield rates by minimizing collisions and aligning errors during the docking process.
Implementation Method 1
forming a plurality of first bonding layers at a plurality of first positions of the back plate; docking the first transfer platform and the back plate after forming the first bonding layers to transfer the first light emitting devices to the first positions by the first bonding layers
Data Source
AI summary
A manufacturing method of a display including the following steps is provided. Firstly, a back plate, a first transfer platform and a second transfer platform are provided, wherein a plurality of first light-emitting devices are disposed on the first transfer platform, and a plurality of second light-emitting devices are disposed on the second transfer platform. Secondly, a plurality of first bonding layers are formed at a plurality of first positions of the back plate. Then, the first transfer platform and the back plate are correspondingly docked, so that the first light-emitting devices are bonded on the first positions through the first bonding layers. After that, a plurality of second bonding layers are formed at a plurality of second positions of the back plate. Finally, the second transfer platform and the back plate are correspondingly docked, so that the second light-emitting devices are bonded on the second positions through the second bonding layers.