Micro LED Transfer System Using Electrostatic Chuck
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Solution Overview
Problem
Current micro LED transfer technologies fail to securely attach micro LEDs to substrates without tilting, as they rely solely on the interaction between the transfer head and the substrate, lacking a mechanism to maintain the LEDs at predetermined positions.
Innovation Solution
A system incorporating an electrostatic chuck below the substrate applies an additional electrostatic force to micro LEDs gripped by the transfer head, ensuring precise positioning and attachment without tilting, using an electrostatic chuck with low resistivity and a porous transfer head with vacuum suction capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If only the interaction between the transfer head and substrate is used for micro LED transfer, then the transfer process is simple, but the micro LEDs cannot be held at predetermined positions and become tilted during attachment
Solution Approach 1:
An electrostatic chuck is introduced as an intermediary device between the substrate and the transfer head. The electrostatic chuck generates an electrostatic field that acts on the micro LEDs during transfer, providing additional control over their positioning and orientation. This intermediary force field enables precise positioning without complicating the mechanical transfer process.
Solution Approach 2:
The patent replaces purely mechanical interaction (transfer head-substrate contact) with an electrostatic field-based mechanism. The electrostatic chuck uses electrical fields to manipulate micro LED positions, eliminating the need for complex mechanical positioning systems while achieving higher precision.
2Manufacturing precision
If an electrostatic chuck is added below the substrate, then micro LED positioning precision is improved, but the device complexity increases
Solution Approach 1:
The electrostatic chuck serves multiple functions simultaneously: it holds the substrate in place, generates electrostatic forces for micro LED positioning, and provides a controlled environment for the transfer process. This multi-functionality reduces the need for separate devices for each function, thereby limiting the increase in overall system complexity.
3Device complexity
If the transfer head uses only mechanical grip, then the transfer mechanism is simple, but the micro LEDs cannot be securely attached without tilting
Solution Approach 1:
The patent replaces mechanical gripping forces with electrostatic forces for securing micro LEDs. The electrostatic chuck generates electrostatic attraction that reliably holds micro LEDs in the correct position and orientation during transfer, providing more consistent and controllable forces than mechanical gripping alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively prevents micro LEDs from tilting during attachment, ensuring accurate alignment and secure bonding on the substrate, enhancing the transfer process and preventing misalignment.
Implementation Method 1
applying an additional force to the micro LED using a chuck provided below the substrate to attract the micro LED onto the substrate
Implementation Method 2
a porous transfer head with vacuum suction capabilities
Data Source
AI summary
The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.