Micro LED Transfer Head Non-Contact Gripping
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Solution Overview
Problem
Current transfer technologies for micro LEDs face challenges such as positional errors and damage during transfer due to direct contact with the grip surface of the transfer head, and existing methods require additional processes like electrostatic charging, adhesive use, or immersion in solutions, which can lead to micro LED damage or positional inaccuracies.
Innovation Solution
A transfer head with a recessed portion that grips the micro LED without direct contact, utilizing electrostatic, magnetic, or suction forces, and featuring an inclined recess to guide the LED correctly, and an anodic oxide film with pores for uniform suction, allowing non-contact transfer and precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If direct contact transfer method is used, then transfer simplicity is improved, but positional accuracy deteriorates due to grip surface contact causing distortion
Solution Approach 1:
The patent introduces a suction cup as an intermediary component between the transfer head and micro LED. The suction cup creates a vacuum field that holds the LED without direct mechanical contact, eliminating grip surface distortion while maintaining transfer simplicity
Solution Approach 2:
The patent replaces direct mechanical contact gripping with a vacuum-based holding system. The suction cup uses negative pressure to secure the LED, substituting mechanical grip forces with atmospheric pressure differential, thereby preventing positional distortion
2Productivity
If electrostatic head is used for transfer, then transfer capability is improved, but LED damage occurs due to electrification during static induction
Solution Approach 1:
The patent replaces electrostatic induction with a vacuum-based holding system. The suction cup uses atmospheric pressure differential to hold the LED, eliminating electrostatic charges and their harmful effects on the micro LED while maintaining effective transfer capability
Solution Approach 2:
The suction cup acts as an intermediary that transfers the LED using vacuum pressure rather than electrostatic forces. This intermediary mechanism avoids direct electrostatic interaction between the transfer head and LED, preventing damage
3Object-affected harmful factors
If elastic polymer material is used, then LED damage is prevented, but additional electrode formation process is required and adhesive force must be maintained
Solution Approach 1:
The patent replaces adhesive-based holding with vacuum-based holding. The suction cup uses atmospheric pressure to secure the LED without requiring adhesive materials or electrode formation processes, simplifying the overall transfer process while preventing LED damage
Solution Approach 2:
The suction cup system is self-contained and self-regulating. The vacuum pressure automatically adjusts to hold the LED securely during transfer, and releasing the vacuum automatically releases the LED, eliminating the need for additional processing steps
4Productivity
If roller with adhesive is used, then continuous transfer is improved, but LED damage occurs when pressed with roller
Solution Approach 1:
The patent replaces mechanical roller pressing with a vacuum-based holding system. The suction cup maintains continuous transfer capability through sustained vacuum pressure without requiring physical contact or pressing forces that could damage the micro LED
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents distortion and positional errors during transfer, ensuring accurate placement and minimizing damage to the micro LEDs by maintaining a spaced distance between the transfer head and the micro LED, while enabling efficient handling of small-sized LEDs.
Implementation Method 1
A micro LED is picked up by the recess portion... by at least one of an electrostatic force, a magnetic force, and a suction force
Implementation Method 2
A micro LED is picked up by the recess portion... by at least one of an electrostatic force, a magnetic force, and a suction force
Implementation Method 3
A micro LED is picked up by the recess portion... by at least one of an electrostatic force, a magnetic force, and a suction force
Implementation Method 4
an anodic oxide film with pores for uniform suction
Data Source
AI summary
The present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED and transferring the micro LED to a display substrate. In particular, the present invention relates to a transfer head for a micro LED, the transfer head gripping a micro LED in a state where a grip surface of the transfer head and an upper surface of the micro LED are not in contact with each other when transferring the micro LED. Accordingly, it is possible to prevent positional error which may occur when transferring the micro LED and prevent damage of the micro LED.