Micro-LED Transfer Head and Film Handling for Precise Placement
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Solution Overview
Problem
The development of display devices, particularly those using inorganic LEDs, requires efficient transfer equipment for micro-LEDs onto substrates, which is currently lacking in terms of precision and efficiency.
Innovation Solution
A light-emitting element transfer system is developed, comprising a raw film cutting device, reversing device, stretching device, and transport head, which forms a transfer member with a base layer, stamp layer, and protective film to accurately transfer micro-LEDs from a transfer film onto a circuit substrate, utilizing a peeling robot and tape dispenser for precise handling and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If transfer equipment for micro-LEDs is developed, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The transfer equipment is divided into multiple independent functional modules: a transfer member holding unit that holds the transfer member, a peeling unit that peels the protective film, and a transfer unit that transfers micro-LEDs. Each module performs a specific function, allowing the system to achieve high placement precision while managing complexity through modular design.
Solution Approach 2:
The system performs preliminary actions by first forming a transfer member with an adhesive layer and protective film before the actual transfer process. The protective film is peeled off in advance to expose the adhesive layer, and the transfer member is prepared and held in position before micro-LED transfer begins, ensuring precision is established beforehand.
2Ease of manufacture
If a disposable transfer member with adhesive layer is used, then ease of manufacture is improved, but loss of substance increases
Solution Approach 1:
The adhesive layer's properties are changed through parameter control: its viscosity is adjusted to be low during the transfer process to enable easy peeling of the protective film and smooth transfer of micro-LEDs. After transfer, the adhesive viscosity increases to prevent residue and material loss, optimizing both manufacturing ease and material efficiency.
3Manufacturing precision
If protective film peeling is implemented, then manufacturing precision is improved, but time consumption increases
Solution Approach 1:
A protective film serves as an intermediary layer between the adhesive layer and the environment during manufacturing and storage. This film protects the adhesive layer from contamination and premature activation. The peeling unit removes this intermediary film just before transfer, ensuring precision is maintained while minimizing time loss through targeted removal only when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enables precise and efficient transfer of light-emitting elements onto circuit substrates, improving the fabrication process for display devices by ensuring accurate placement and alignment of micro-LEDs, enhancing the overall performance and reliability of the display panels.
Implementation Method 1
transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member
Implementation Method 2
The peeling robot may peel off the protective film from the stamp layer of the transfer member by using a tape having an adhesive surface
Data Source
AI summary
A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.