Micro LED Transfer Using Substrate Protrusions
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Solution Overview
Problem
The manufacturing of micro LED array display devices is hindered by the high precision requirements and increased costs due to potential interferences between small-sized opto-electronic units (micro LEDs) and other components on the substrate during the transfer process, leading to poor quality and increased inspection and repair costs.
Innovation Solution
A manufacturing method involving the use of protrusions on the substrate with specific thickness and design to support opto-electronic units, allowing for precise transfer and bonding using adhesive materials, thereby minimizing collisions and interferences, and including a polycrystalline selecting device for alignment and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If directly using a pick-up head to grab micro LEDs from the carrier and transfer them to the matrix substrate, then the transfer process is simplified, but the micro LEDs easily have interferences with other components on the matrix substrate due to their fine size
Solution Approach 1:
The patent introduces protrusions that extend upward from the matrix substrate, creating a vertical dimension (Z-axis) for the transfer process. The pick-up head transfers micro LEDs to these protrusions rather than directly to the substrate surface, effectively adding a height dimension that separates the transfer zone from other planar components. This dimensional change allows simplified transfer operations while maintaining precision, as the protrusions act as elevated receiving points that are spatially distinct from surrounding circuitry and structures.
Solution Approach 2:
The protrusions serve as intermediary structures between the pick-up head and the final micro LED positions on the matrix substrate. Instead of directly placing micro LEDs onto the substrate surface among other components, the protrusions act as intermediate receiving points that facilitate the transfer process. These intermediaries provide dedicated transfer zones that are spatially separated from other components, reducing interference while maintaining manufacturing simplicity.
2Reliability
If using protrusions with height greater than matrix circuit thickness to transfer opto-electronic units, then collisions and interferences with other components are avoided, but the device structure becomes more complex
Solution Approach 1:
The patent segments the substrate structure by adding discrete protrusions at specific locations where opto-electronic units need to be transferred. Rather than making the entire substrate more complex, only specific localized regions are elevated into protrusions. This segmentation approach provides the necessary height for collision-free transfer only where needed, while leaving the rest of the substrate structure simple and planar, thus minimizing overall device complexity while maintaining reliability.
Solution Approach 2:
The protrusions provide localized height and protection only at specific positions where opto-electronic unit transfer is required, rather than uniformly increasing the entire substrate structure. This local quality approach ensures that the additional structural complexity is confined to minimal necessary areas, providing component protection and transfer facilitation precisely where needed while keeping the rest of the device structure simple.
3Manufacturing precision
If increasing the precision requirement for micro LED fabrication, then the display device quality is improved, but the manufacturing time and cost are increased
Solution Approach 1:
The protrusions are pre-formed on the matrix substrate before the micro LED transfer process. This preliminary action creates predetermined, precisely positioned receiving structures that guide the transfer process. By having the protrusions ready in advance with exact positions and heights, the actual transfer operation can proceed more efficiently without requiring complex real-time positioning adjustments, thus maintaining high precision while improving manufacturing speed and reducing costs.
Data Source
AI summary
An opto-electronic apparatus and a manufacturing method thereof are disclosed. The manufacturing method of the opto-electronic apparatus includes the following steps of: disposing a matrix circuit on a substrate, wherein the matrix circuit has a matrix circuit thickness between the highest point of the matrix circuit and the surface of the substrate; disposing a plurality of first protrusions above the substrate, wherein at least one of the first protrusions has a first protrusion thickness between the highest point of the first protrusion and the surface of the substrate, and the first protrusion thickness is greater than the matrix circuit thickness; and performing a transfer step for transferring a plurality of first opto-electronic units from a first carrier to the first protrusions and bonding the first protrusions to at least two of the first opto-electronic units with an adhesive material.