Micro-LED Transfer via Sacrificial Layer and Bonding
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Solution Overview
Problem
Current micro-LED transfer methods using pickup heads are complex and face issues with yield and stability, making them inefficient for high-quality micro-LED production.
Innovation Solution
A micro-LED transfer method involving a sacrificial layer on a carrier substrate, where micro-LEDs are bonded with different types of layers for lifting-off and transfer to a receiving substrate, eliminating the need for a complicated pickup head, using a solder layer with a low melting point and a polymer layer for bonding and lifting-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pickup head is used to transfer micro-LEDs, then micro-LED transfer can be achieved, but the process becomes complicated and yield and stability deteriorate
Solution Approach 1:
The patent extracts and eliminates the pickup head component from the transfer system. Instead of using a pickup head to grasp and transfer micro-LEDs, the invention uses a carrier substrate with bonding layers that enable direct bonding and lifting-off of micro-LEDs, thereby removing the complex pickup head mechanism and improving transfer stability
Solution Approach 2:
The patent introduces bonding layers (first bonding layer, second bonding layer, third bonding layer) as intermediary elements between the carrier substrate, pickup substrate, and receiving substrate. These bonding layers facilitate controlled bonding and lifting-off processes, enabling reliable micro-LED transfer without requiring a pickup head
2Ease of manufacture
If a pickup head is used to transfer micro-LEDs, then micro-LED transfer can be achieved, but the process becomes complicated and manufacturing complexity increases
Solution Approach 1:
The patent removes the pickup head equipment from the manufacturing process. The transfer is achieved through a simplified process involving bonding layers and lifting-off mechanisms that can be implemented with standard semiconductor manufacturing equipment, thereby easing manufacturing complexity
Solution Approach 2:
The patent replaces the mechanical pickup head system with a chemical/bonding-based system. Instead of mechanically grasping and moving micro-LEDs with a pickup head, the invention uses bonding layers that enable controlled adhesion and release, substituting a complex mechanical system with a simpler bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, improves yield, and enhances stability, reducing costs and enabling large-scale processing without the need for complex equipment, while maintaining high-quality micro-LED transfer.
Implementation Method 1
micro-LEDs are bonded on the carrier substrate through a first bonding layer
Implementation Method 2
bonding the micro-LEDs to be picked up with a pickup substrate through a second bonding layer
Implementation Method 3
the melting point of the first bonding layer is lower than 280° C., and the micro-LEDs to be picked up are lifted-off from the carrier substrate through heating
Implementation Method 4
the sacrificial layer is a photo resist and the sacrificial layer is patterned through photo lithography
Implementation Method 5
removing the sacrificial layer by undercutting
Data Source
AI summary
A micro-LED transfer method and a manufacturing method are disclosed. The micro-LED transfer method comprises: coating a sacrificial layer on a carrier substrate, wherein micro-LEDs are bonded on the carrier substrate through a first bonding layer (S1100); patterning the sacrificial layer to expose micro-LEDs to be picked up (S1200); bonding the micro-LEDs to be picked up with a pickup substrate through a second bonding layer (S1300); removing the sacrificial layer by undercutting (S1400); lifting-off the micro-LEDs to be picked up from the carrier substrate (S1500); bonding the micro-LEDs on the pickup substrate with a receiving substrate through a third bonding layer (S1600); and lifting-off the micro-LEDs from the pickup substrate (S1700).