Micro LED Display Transfer With Light Shielding and Adhesive Protection
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Solution Overview
Problem
The existing micro LED display manufacturing process damages the adhesive between the positioning carrier and micro LEDs during the transfer process, leading to micro LEDs shifting and resulting in dark spots and reduced yield.
Innovation Solution
A method involving a light shielding layer is formed on the micro LEDs and adhesive residues, with the light shielding layer filling gaps between the LEDs, and selective etching to expose the second surfaces of the micro LEDs, which are then transferred to an array substrate, reducing the risk of adhesive damage and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching is used to remove adhesive residues on micro LEDs transferred to the positioning carrier, then adhesive residues are removed, but the adhesive between the positioning carrier and micro LEDs is damaged causing micro LEDs to shift
Solution Approach 1:
The patent divides the adhesive residue removal process into two distinct stages: first removing residues from the micro LED surface, then removing residues from the positioning carrier surface. This segmentation prevents the adhesive between the carrier and micro LEDs from being damaged during the removal process, thereby maintaining adhesive integrity while achieving complete residue removal.
Solution Approach 2:
The patent performs preliminary actions by first transferring micro LEDs to the positioning carrier, then selectively removing adhesive residues from the micro LED surface before removing residues from the carrier surface. This preliminary sequence of actions ensures that the adhesive bonding the micro LEDs to the carrier remains intact throughout the process.
2Productivity
If micro LEDs are transferred from the positioning carrier to the array substrate, then mass transfer is achieved, but adhesive damage causes micro LEDs to shift resulting in dark spots and reduced yield
Solution Approach 1:
The patent segments the adhesive residue removal into two distinct operations: removing residues from micro LEDs first, then removing residues from the positioning carrier. This ensures that the adhesive bonding micro LEDs to the carrier remains intact during mass transfer, preventing positioning shifts and maintaining manufacturing precision while achieving high productivity.
Solution Approach 2:
The patent applies beforehand cushioning by carefully controlling the adhesive residue removal process to protect the adhesive layer that bonds micro LEDs to the positioning carrier. By removing residues without damaging the adhesive, the patent cushions against potential positioning errors during the subsequent transfer to the array substrate, preventing dark spots and maintaining yield.
3Manufacturing precision
If adhesive between positioning carrier and micro LEDs is damaged, then adhesive residue removal is achieved, but micro LEDs shift and fail to light up reducing yield
Solution Approach 1:
The patent segments the residue removal process into two separate steps: first removing adhesive residues from the micro LED surface, then removing residues from the positioning carrier surface. This segmentation enables complete adhesive residue removal while preserving the integrity of the adhesive bonding micro LEDs to the carrier, thereby preventing micro LED shifting and maintaining high manufacturing yield.
Solution Approach 2:
The patent performs preliminary removal of adhesive residues from micro LEDs before removing residues from the positioning carrier. This preliminary action ensures that no adhesive damage occurs during the removal process, maintaining both manufacturing precision and productivity by preventing yield-reducing defects.
Data Source
AI summary
A display device includes an array substrate, light emitting elements and light shielding units. The light emitting elements are disposed on the array substrate and electrically connected to the array substrate, where each of the light emitting elements has a first surface and a second surface opposite to the first surface. The second surfaces face the array substrate. The light shielding units are disposed on the array substrate and arranged alternately with the light emitting elements, where the light shielding units expose the first surfaces, and each of the light shielding units has a top and a bottom opposite to the top. The bottoms face the array substrate, and a cavity is existed between the bottoms and the array substrate.