Micro-LED Transfer via Vaporized Adhesive Gas Pressure

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Solution Overview

Problem

The challenge in manufacturing micro-light-emitting diode (micro-LED) displays lies in efficiently transferring micro-light-emitting diodes from a donor substrate to an acceptor substrate without adhesive force, especially when the size is scaled down, as gravitational force is insufficient to overcome van der Waals forces, leading to low product yield and increased complexity.

Innovation Solution

A manufacturing method involving a light-absorbing and vaporizable adhesive layer on a light-transmitting substrate, which absorbs light energy to vaporize and generate a gas pressure force, allowing micro-light-emitting diodes to be transferred from the donor substrate to the acceptor substrate through an empty space without additional transfer jigs, enabling precise control and low-cost production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If gravitational force is used to transfer micro-light-emitting diodes, then the transfer process is simple, but gravitational force is insufficient to overcome van der Waals forces at scaled-down sizes

Engineering Contradiction:

Improvetransfer process simplicityVSAvoidgravitational force insufficiency

Core Design Contradiction:

Ease of manufactureVSForce

Solution Approach 1:

The patent replaces the mechanical gravitational force system with a photonic system. Light energy is used to vaporize the adhesive layer, generating gas pressure that propels the micro-LEDs. This substitution of mechanical force with optical energy enables effective transfer at micro-scales where gravity is insufficient.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes phase transition of the adhesive layer from solid/liquid to gas through light-induced vaporization. This phase change generates the gas pressure force needed to overcome van der Waals forces and propel micro-LEDs across the empty space to the acceptor substrate.

Inventive Principle:

Principle #36Phase transitions

2Manufacturing precision

If additional transfer jigs are used to transfer micro-light-emitting diodes, then transfer precision can be improved, but device complexity and cost increase

Engineering Contradiction:

Improvetransfer precisionVSAvoidtransfer jig complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent implements a self-service transfer mechanism where the micro-LEDs are propelled by gas pressure generated from vaporization of the adhesive layer beneath them. The system uses its own adhesive layer as the propellant source, eliminating the need for external transfer jigs or complex positioning mechanisms.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent employs pneumatic principles by using gas pressure generated from vaporization to propel the micro-LEDs. The vaporized adhesive layer creates a gas cushion that pushes the micro-LEDs across the empty space to the acceptor substrate, replacing mechanical transfer jigs with a pneumatic propulsion system.

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Ease of manufacture

If micro-light-emitting diodes are transferred through contact with substrates, then transfer can be achieved, but element damage occurs due to contact forces

Engineering Contradiction:

Improvetransfer capabilityVSAvoidelement damage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a gas cushion as an intermediary between the micro-LEDs and the substrates. The vaporized adhesive layer creates a gas barrier that allows the micro-LEDs to be propelled through empty space without direct contact with the substrates, preventing mechanical damage while enabling transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively transfers micro-light-emitting diodes with high precision and low cost, avoiding damage from element contact and allowing for efficient scaling down to small sizes, thereby improving product yield and simplifying the manufacturing process.

Implementation Method 1

a light-absorbing and vaporizable adhesive layer on a light-transmitting substrate, which absorbs light energy to vaporize

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

absorbs light energy to vaporize and generate a gas pressure force

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 3

generate a gas pressure force, allowing micro-light-emitting diodes to be transferred

Methodology Applied

Scientific EffectGas pressure: Pressure Increase

Data Source

PatentUS10446720B2Semiconductor structure, light-emitting device and manufacturing method for the same

Publication Date: 2019.10.15 IND TECH RES INST

AI summary

A semiconductor structure, a light-emitting device and a manufacturing method for the same are provided. The light-emitting device includes a light emitting diode and a conductive film. The conductive film contains quantum dots and is disposed on the light emitting diode.