Micro LED Transfer Wiring Using Anisotropic Adhesive Electrodes
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Solution Overview
Problem
Current display technologies face challenges in implementing large area high pixel displays using semiconductor light emitting elements due to the need for stable assembly and transfer of these elements onto wiring substrates, while minimizing defects in the wiring process.
Innovation Solution
A method involving the transfer of semiconductor light emitting elements to a wiring substrate with an anisotropy conductive adhesive paste layer, where the paste is only formed on the conductive electrodes and their periphery, and the wiring electrode has a surface roughness structure to enhance contact and stability during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor light emitting elements are assembled or transferred to a wiring substrate, then a large area high pixel display device can be implemented, but the process becomes complex and defect issues arise in the wiring process
Solution Approach 1:
The patent merges the transfer process and wiring process into a single integrated operation. The anisotropic conductive adhesive paste is applied to the semiconductor light emitting elements before transfer, so that when elements are placed on the wiring substrate, electrical connections are simultaneously established through the conductive paste, eliminating the need for separate wiring steps and reducing associated defects
Solution Approach 2:
The anisotropic conductive adhesive paste serves as an intermediary material that enables both mechanical attachment and electrical connection between the semiconductor light emitting elements and the wiring substrate. This mediator material resolves the complexity of separate transfer and wiring operations by combining both functions in a single material layer
2Ease of manufacture
If semiconductor light emitting elements are transferred to a wiring substrate, then display device can be manufactured, but the risk of short circuits and defects increases
Solution Approach 1:
The patent applies local quality by using anisotropic conductive adhesive paste that conducts electricity only in the vertical direction (perpendicular to the substrate) while remaining insulating in the horizontal direction. This directional conductivity ensures reliable electrical connections between individual elements and their corresponding wiring electrodes without creating unwanted lateral conductive paths that could cause short circuits
Solution Approach 2:
The anisotropic conductive adhesive paste is applied to the semiconductor light emitting elements before the transfer process. This preliminary application ensures that the elements are pre-coated with the conductive material, so that when they are placed on the wiring substrate, electrical connections are immediately established without requiring subsequent wiring steps, thereby reducing the risk of defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for stable transfer of semiconductor light emitting elements to the wiring substrate, reducing the risk of short circuits and defects, and enables efficient electrical connection while maintaining the elements' stability and performance.
Implementation Method 1
forming an anisotropy conductive adhesive paste layer on an upper surface of the semiconductor light emitting element transferred to the second temporary substrate
Implementation Method 2
The wiring electrode may have a surface roughness structure
Data Source
AI summary
Disclosed in the present specification is a micro LED display device, and a manufacturing method therefor, the method forming, in advance, an anisotropic conductive adhesive paste layer only on a conductive electrode part of a semiconductor light emitting element and on a peripheral part thereof, and then transferring the anisotropic conductive adhesive paste layer to a wiring substrate, thereby simultaneously performing a transfer step and a stable wiring step.