Micro LED Transferring via Photosensitive Bonding Layer
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Solution Overview
Problem
Conventional Micro LED mass transferring methods require complex detecting and repairing processes due to the need to replace abnormal Micro LEDs after they are already bonded to a receiving substrate, which complicates the process and increases costs.
Innovation Solution
A Micro LED transferring method that uses a photosensitive conductive bonding layer to detect and bond Micro LEDs during the transferring process, where normal Micro LEDs are bonded and abnormal ones are not, eliminating the need for post-bonding detection and replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Micro LED is bonded to receiving substrate first and then detected, then bonding is completed, but detecting and repairing processes become complicated
Solution Approach 1:
The patent applies preliminary action by detecting the Micro LED light emission function before bonding to the receiving substrate. The transferring substrate includes a detecting circuit that tests each Micro LED's functionality during the transferring process. Only Micro LEDs that pass the detection are bonded to the receiving substrate, eliminating the need for complex post-bonding detection and repair processes.
Solution Approach 2:
The patent introduces an intermediary detecting circuit on the transferring substrate that mediates between the Micro LED array and the receiving substrate. This detecting circuit serves as a temporary testing interface that allows functionality verification before final bonding, simplifying the overall process by separating detection from the bonding operation.
2Reliability
If abnormal Micro LED is replaced after bonding, then light emission function is restored, but manufacturing time and cost increase
Solution Approach 1:
The patent performs the replacement action preliminarily by identifying and excluding abnormal Micro LEDs before bonding occurs. The detecting circuit on the transferring substrate identifies defective Micro LEDs, and only functional ones are transferred to the receiving substrate. This prevents the need for time-consuming post-bonding replacement operations and improves manufacturing efficiency.
3Productivity
If all Micro LEDs are bonded without pre-detection, then transferring process is simple, but abnormal Micro LEDs cannot be identified
Solution Approach 1:
The patent merges the detection function with the transferring substrate itself. The detecting circuit is integrated onto the transferring substrate, allowing simultaneous detection and transferring operations. This combination maintains high transferring speed while ensuring reliability by identifying functional Micro LEDs before bonding.
Solution Approach 2:
The transferring substrate provides self-service by including its own detecting circuit that automatically tests Micro LED functionality during the transferring process. This self-detection capability eliminates the need for separate external detection equipment, maintaining efficient production flow while ensuring product quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the detecting and repairing processes by ensuring all Micro LEDs emit light normally, reducing manufacturing costs and improving display uniformity by ensuring only functional LEDs are bonded, thereby enhancing pixels per inch (PPI).
Implementation Method 1
The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer can be bonded together
Data Source
AI summary
A Micro LED transferring method, a Micro LED display panel and a Micro LED display device are provided. The Micro LED display panel includes a substrate, a pixel defining layer including multiple openings, first conducting layer located in the multiple openings, photosensitive conductive bonding layers and Micro LED structures. The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer are bonded together. Due to the photosensitive conductive bonding layer, a Micro LED is detected during a transferring process rather than after a bonding process, thereby eliminating a step of removing a bonded abnormal Micro LED, thus simplifying the detecting and repairing processes of Micro LEDs.