Micro-LED Vertical Assembly for Large High-Resolution Displays
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Solution Overview
Problem
The existing display technologies face challenges in manufacturing large-screen high-resolution displays using semiconductor light-emitting elements, particularly due to high manufacturing costs and defect rates.
Innovation Solution
A method for manufacturing a display device using a vertical semiconductor light-emitting element, which involves forming an assembly electrode on a substrate, applying an insulating layer, defining an assembly groove, and assembling the LED into the groove using a magnetic body and electric field, thereby reducing manufacturing costs and defect rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If semiconductor light-emitting elements are combined with a substrate to create large-screen high-resolution displays, then display resolution and screen size are improved, but manufacturing cost increases
Solution Approach 1:
The patent segments the manufacturing process into two distinct stages: (1) bulk growth of LED arrays on a separate substrate using cost-effective techniques, and (2) transfer of individual LEDs to the display substrate. This segmentation allows each stage to be optimized independently, reducing overall manufacturing cost while maintaining high resolution.
Solution Approach 2:
The patent transfers LEDs from a horizontal growth configuration on the source substrate to a vertical mounting configuration on the display substrate. This dimensional change enables more efficient use of substrate area and facilitates higher density arrangements, achieving high resolution without proportionally increasing manufacturing complexity.
2Area of stationary object
If a large number of semiconductor light-emitting elements are used for large-screen displays, then screen size and resolution are improved, but defect rate increases
Solution Approach 1:
The patent performs preliminary quality assessment and characterization of LEDs on the source substrate before transfer. Defective elements are identified and excluded from the transfer process, ensuring that only functional LEDs are mounted on the display substrate. This preliminary action prevents defect propagation and maintains high reliability in large-screen displays.
Solution Approach 2:
The transfer process incorporates self-alignment and self-selection mechanisms where LEDs are automatically positioned and oriented on the substrate based on their geometric and electrical characteristics. This self-service approach minimizes human intervention and reduces the risk of introducing defects during the assembly of large numbers of elements.
3Ease of manufacture
If conventional horizontal LED structures are used, then manufacturing process is simple, but assembly density and resolution are limited
Solution Approach 1:
The patent transitions from horizontal LED mounting to vertical LED orientation on the display substrate. This dimensional change allows LEDs to be arranged in three-dimensional space rather than constrained to a two-dimensional plane, significantly increasing assembly density and enabling higher resolution displays while maintaining compatibility with conventional LED fabrication processes.
Solution Approach 2:
The patent implements a nested structure where multiple LED elements are arranged in vertical stacks or layered configurations on the substrate. This nesting approach maximizes the use of available substrate area by utilizing vertical space, thereby increasing assembly density without complicating the fundamental LED structure or manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of vertical semiconductor light-emitting elements in the display device reduces manufacturing costs and allows for easier assembly of a large number of elements on a substrate, thereby improving the defect rate and enabling the production of large-screen high-resolution displays.
Implementation Method 1
contacting the assembly face of the LED to the assembly groove using an assembly device having a magnetic body
Implementation Method 2
assembling the assembly face of the LED into the assembly groove based on an electric field applied through the assembly electrode formed on the substrate
Data Source
AI summary
A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.