Micro LED Vertical Electrode Assembly for Easier Substrate Wiring
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Solution Overview
Problem
The challenge lies in developing a display device using semiconductor light emitting elements with a vertical structure, where the wiring process for electrical connection to the substrate is difficult due to the placement of conductivity-type electrodes at both ends, which is not as straightforward as with horizontal structures.
Innovation Solution
The solution involves a display device design with a substrate, wiring electrodes, assembly electrodes, and insulating films, where stepped parts are formed under assembly recesses, and the wiring electrodes protrude to be melted and connected to the conductivity-type electrodes of the semiconductor light emitting elements using a laser, allowing for easier electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a vertical structure semiconductor light emitting element is used, then the manufacturing efficiency and number of elements per substrate area are improved, but the wiring process complexity increases due to electrode placement at both ends
Solution Approach 1:
The patent transitions from a horizontal structure to a vertical structure semiconductor light emitting element, changing the spatial dimension of the element orientation. This allows more elements to be arranged on the substrate area, improving productivity while managing wiring complexity through the specific vertical configuration with electrodes at both ends.
Solution Approach 2:
The patent divides the wiring process into two separate connections: one wiring electrode connects to the first conductivity-type electrode at one end, and another wiring electrode connects to the second conductivity-type electrode at the other end. This segmentation of electrical connections simplifies the overall wiring process by treating each end independently rather than attempting to manage all connections simultaneously.
2Productivity
If the size of semiconductor light emitting elements is reduced, then the number of elements that can be produced on a given substrate area increases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent forms the first and second wiring electrodes in advance before assembling the semiconductor light emitting elements. This preliminary preparation of the wiring structure allows for precise positioning and reduces the precision requirements during the actual element assembly process, enabling mass production of smaller elements while maintaining manufacturing feasibility.
3Ease of manufacture
If wiring electrodes are formed before assembling semiconductor light emitting elements, then the wiring process is simplified, but the assembly precision requirements increase
Solution Approach 1:
The patent utilizes the vertical structure with wiring electrodes extending in the vertical direction to connect with the semiconductor light emitting elements. This vertical arrangement provides clear spatial separation and defined connection points, making it easier to form wiring electrodes beforehand while maintaining acceptable assembly precision through the structured vertical configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and reliable electrical connection to vertical semiconductor light emitting elements, overcoming the difficulties associated with their vertical structure and facilitating the assembly process.
Implementation Method 1
the wiring electrodes protruding towards the assembly recesses are melted and connected to the conductivity-type electrodes
Data Source
AI summary
The present specification provides a new type of a display device in which a wiring process is easily performed after a semiconductor light emitting element having a vertical structure is assembled on a substrate. Here, a semiconductor light emitting device according to an embodiment of the present invention is characterized by comprising: a substrate; a wiring electrode positioned on the substrate; a dielectric film positioned on the wiring electrode; an assembly electrode positioned on the dielectric film; an assembly insulating film positioned on the assembly electrode; a partition wall positioned on the assembly insulting film and defining an assembly groove to which a semiconductor light emitting element is assembled; and the semiconductor light emitting element which is assembled to the assembly groove and provided with conductive electrodes on both ends thereof, wherein the wiring electrode is provided with a protrusion portion, and the protrusion portion protrudes toward the assembly groove and is electrically connected to the conductive electrode on one end of the semiconductor light emitting element.