Micro LED Mounting Via-Hole Contact Surface
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Solution Overview
Problem
Existing micro LED mounting structures face issues with short circuits and low reliability due to randomly distributed electrode bumps, which require high pressure and result in point contacts, leading to potential electrical failures.
Innovation Solution
A micro LED mounting structure featuring a conductive pad on a substrate with via-holes extending through a second layer, filled with conductive material, allowing for electrical connection without additional intermediate media, preventing short circuits and enhancing reliability by forming flat contact surfaces that match the size of the micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrode bumps are randomly distributed in solder material for mounting micro LED, then electrical contact can be achieved, but high pressure is required and short circuits may occur
Solution Approach 1:
The patent divides the contact interface into distinct segments: a conductive pad on the substrate and a separate contact surface on the micro LED, connected by precisely positioned via-holes. This segmentation eliminates the random distribution of electrode bumps while maintaining reliable electrical contact through defined conductive paths.
Solution Approach 2:
The patent introduces an intermediary structure (the conductive pad with via-holes) between the substrate and micro LED. This intermediary provides a controlled, flat contact surface that mediates the electrical connection, preventing direct contact between opposing electrodes and thus avoiding short circuits.
2Reliability
If high pressure is applied to solder material to make electrical contact, then contact is achieved, but the solder material may cause short circuits between electrodes
Solution Approach 1:
The patent extracts the harmful element (randomly distributed electrode bumps in solder material) and replaces it with a structured conductive pad design. The via-holes provide precise conductive paths without the need for high pressure, eliminating the source of potential short circuits.
Solution Approach 2:
Instead of applying high pressure to deform solder material to achieve contact, the patent inverts the approach by creating a flat contact surface that naturally conforms to the micro LED, eliminating the need for high pressure and the associated short circuit risk.
3Ease of manufacture
If electrode bumps provide point contacts between substrate and electric element, then electrical connection is made, but reliability is low
Solution Approach 1:
The patent transitions from point contacts (zero-dimensional) to a planar contact surface (two-dimensional). The flat contact surface on the micro LED provides extensive area contact instead of discrete point contacts, significantly improving reliability while maintaining ease of manufacture.
Data Source
AI summary
A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.