Micro-LED Display Structure for High-Resolution Wafer-Level Fabrication
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Solution Overview
Problem
The manufacturing process for display devices using micro LEDs is time-consuming and costly due to the labor-intensive pick-and-place method of mounting individual LEDs, which increases with higher pixel counts and resolution, making it difficult to achieve high-resolution, low-power, and cost-effective displays.
Innovation Solution
A display device structure featuring a substrate with transistors and light-emitting diodes in a matrix configuration, where the LEDs are positioned closer to the substrate and emit light towards it, allowing for simultaneous attachment of transistors and LEDs, reducing manufacturing time and cost, and incorporating a metal oxide layer for low power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pick-and-place method is used to mount individual LED chips, then the display device can be manufactured with conventional processes, but the manufacturing time becomes extremely long and manufacturing cost increases
Solution Approach 1:
The patent merges the LED chip mounting process with the transistor fabrication process by forming both components simultaneously on the same substrate using the same semiconductor manufacturing steps. This eliminates the separate pick-and-place mounting step, resolving the contradiction between using conventional processes and achieving high manufacturing speed.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the LED chips and transistors together on the substrate during the fabrication process itself, rather than mounting pre-made LED chips later. This preliminary integration enables high productivity while maintaining process feasibility.
2Manufacturing precision
If the number of pixels and resolution are increased, then the display quality is improved, but the number of LEDs to be mounted increases and the degree of difficulty in mounting increases
Solution Approach 1:
The patent merges LED chip formation with transistor fabrication into a single integrated process. This allows high-resolution displays with many pixels to be manufactured without proportionally increasing mounting complexity, as both components are created together using standard semiconductor manufacturing techniques.
Solution Approach 2:
The patent replaces the mechanical pick-and-place mounting system with a semiconductor fabrication-based formation process. This substitution enables high-resolution manufacturing by using precise photolithography and deposition techniques instead of mechanical handling, thereby reducing mounting complexity.
3Manufacturing precision
If individual LED chips are mounted one by one, then each LED can be precisely positioned, but the manufacturing cost increases and manufacturing time becomes extremely long
Solution Approach 1:
The patent merges LED chip creation with transistor fabrication into simultaneous processes. This eliminates the time-consuming sequential mounting operation while maintaining positioning precision through the inherent precision of semiconductor manufacturing alignment and patterning techniques.
Solution Approach 2:
The patent uses photolithographic copying techniques to replicate LED and transistor patterns across the substrate simultaneously. This copying approach achieves precise positioning of all components at once, eliminating the need for time-consuming individual placement while maintaining high positioning accuracy.
4Ease of manufacture
If conventional transistors are used with LEDs, then the display device can be manufactured with standard processes, but power consumption is high
Solution Approach 1:
The patent merges LED and transistor fabrication into a single process using metal oxide semiconductor materials for both components. This integration enables low power consumption through the inherent properties of metal oxide semiconductors while maintaining compatibility with standard semiconductor manufacturing processes.
Solution Approach 2:
The patent changes the material parameter from conventional semiconductor to metal oxide semiconductor. This material parameter change reduces power consumption while maintaining ease of manufacture through compatibility with existing semiconductor fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high-resolution, low-power, and cost-effective display devices with improved yield, as it simplifies the manufacturing process and reduces the complexity of mounting LEDs, while utilizing a metal oxide layer to enhance transistor efficiency.
Implementation Method 1
The plurality of light-emitting diodes emit light toward the substrate
Data Source
AI summary
A display device with high resolution is provided. A display device with high display quality is provided. The display device includes a substrate, an insulating layer, a plurality of transistors, and a plurality of light-emitting diodes. The plurality of light-emitting diodes are provided in a matrix over the substrate. Each of the plurality of transistors is electrically connected to at least one of the plurality of light-emitting diodes. The plurality of light-emitting diodes are positioned closer to the substrate than the plurality of transistors are. The plurality of light-emitting diodes emit light toward the substrate. Each of the plurality of transistors includes a metal oxide layer and a gate electrode. The metal oxide layer includes a channel formation region. The top surface of the gate electrode is substantially level with the top surface of the insulating layer.