Micro LED Wafer-Unit Transfer for Precise Sub-Pixel Assembly
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Solution Overview
Problem
The challenge in manufacturing micro LED display panels lies in the accurate transfer of small micro LEDs, which decreases the yield of successful panels as the number of transfers increases, due to their minute size.
Innovation Solution
The solution involves forming and transferring light-emitting units, each comprising multiple micro LEDs sharing a common wafer unit, onto a substrate, where each unit occupies multiple sub-pixel regions, ensuring accurate placement and efficient production by reducing the number of individual micro LED transfers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple individual micro LEDs are transferred separately into sub-pixel regions, then each sub-pixel region can be populated, but the number of transfers increases and manufacturing precision decreases
Solution Approach 1:
The patent combines multiple micro LEDs that will be placed in different sub-pixel regions onto a single carrier wafer, forming a light-emitting unit. This unit is then transferred as one assembly rather than as individual micro LEDs, reducing the number of transfer operations while maintaining precise placement in all sub-pixel regions.
2Manufacturing precision
If the size of micro LEDs is reduced to achieve higher resolution, then display quality improves, but transfer accuracy becomes more difficult to maintain
Solution Approach 1:
The patent introduces a carrier wafer as an intermediary structure that holds multiple micro LEDs during the transfer process. This carrier wafer provides a stable platform for handling and positioning micro LEDs, enabling accurate transfer of small-sized micro LEDs to their designated sub-pixel regions without direct manipulation of the tiny components.
3Productivity
If the number of transfer operations is increased to populate all sub-pixel regions, then complete panel assembly is achieved, but the yield of successful panels decreases
Solution Approach 1:
By combining multiple micro LEDs into a single light-emitting unit on a carrier wafer and transferring the entire unit in one operation, the patent reduces the total number of transfer operations required. This reduction minimizes the cumulative probability of transfer failures, thereby improving the overall yield of successfully assembled panels while still achieving complete population of all sub-pixel regions.
Data Source
AI summary
A micro LED display panel capable of simpler but more precise manufacture by pre-loading micro LEDs onto wafers which are then transferred to a substrate includes the substrate and light-emitting units. Each light-emitting unit includes a wafer unit and at least two micro LEDs on the wafer unit. The display panel includes pixel regions, each pixel region including at least three adjacent sub-pixel regions. Each sub-pixel region has one micro LED therein. Each micro LED of the light-emitting units is located in one sub-pixel region and the micro LEDs in each pixel regions emit light of different colors.