Micro-LED Pixel Structure With Wavelength Conversion Layers
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Solution Overview
Problem
Existing micro-LED display technologies face challenges in achieving high efficiency and uniformity in light emission due to limitations in current light transmissive layers and pixel structures.
Innovation Solution
The proposed display device incorporates a pixel structure with a circuit substrate, a light emitting element connected to a transistor, a frame layer with a cavity, and a light transmissive layer containing a wavelength conversion material. This configuration allows for efficient light emission and improved color gamut.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional light transmissive layer is used in micro-LED displays, then the device structure is simple, but light emission efficiency and color uniformity are insufficient
Solution Approach 1:
The light transmissive layer is divided into multiple sub-layers (first light transmissive layer, second light transmissive layer, third light transmissive layer) with different functions. Each layer is positioned at specific heights relative to the light emitting element, creating a segmented structure that optimizes light extraction and wavelength conversion efficiency while maintaining color uniformity across the display.
Solution Approach 2:
The patent introduces vertical dimensionality by positioning light transmissive layers at different heights above the light emitting element. The first light transmissive layer is at a first height, the second light transmissive layer is at a second height above the first, and the third light transmissive layer is at a third height above the second. This multi-level vertical arrangement enables sophisticated light management in the vertical dimension, improving light emission efficiency and color uniformity without planar complexity.
2Manufacturing precision
If wavelength conversion material is added to improve color gamut, then color uniformity improves, but the device structure becomes more complex
Solution Approach 1:
Different light transmissive layers are positioned at different vertical locations to perform specialized functions. The first light transmissive layer handles primary light transmission, the second light transmissive layer incorporates wavelength conversion material for color transformation, and the third light transmissive layer provides additional color enhancement or filtering. This local differentiation of layer qualities enables precise color uniformity control while managing structural complexity through functional specialization.
Solution Approach 2:
The light transmissive layer structure employs composite material design by combining multiple layers with different optical properties. Each layer may contain different wavelength conversion materials or have different refractive indices, creating a composite structure that achieves superior color uniformity and gamut. The composite approach allows optimization of each layer's material properties for its specific function rather than using a single homogeneous material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light emission efficiency, improves color uniformity, and extends the lifespan of micro-LED displays by effectively utilizing wavelength conversion materials and optimized pixel structures.
Implementation Method 1
a light transmissive layer in the at least one cavity and in an illuminated area by the at least one light emitting element, the light transmissive layer includes a wavelength conversion material to emit a second light with a second wavelength, wherein the first wavelength is different from the second wavelength
Data Source
AI summary
A light emitting-diode (LED) display device is provided. The display device comprises plural pixels arranged in array and each pixel includes at least one LED chip. The LED chip is disposed at a cavity of a black matrix (BM) layer and electrical connected to a transistor of a circuit substrate, wherein the transistor is below the BM layer.


