Micro LED Array Wet Alignment for Large-Area Circuit Bonding
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Solution Overview
Problem
The existing methods for manufacturing micro light emitting device arrays, such as the pick and place method, face challenges with decreasing productivity as the size of micro light emitting devices decreases and the size of displays increases, particularly when transferring multiple color-emitting devices, which leads to increased time and cost in the transfer process.
Innovation Solution
A method involving a display transfer structure with alignment marks and a driving circuit board, where micro light emitting devices are aligned using a wet alignment method, allowing for efficient bonding to the circuit board through alignment marks, enabling rapid transfer and assembly of micro light emitting devices across a large area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick and place method is used to transfer micro light emitting devices to the substrate, then the transfer process can be performed, but the productivity decreases as the size of micro light emitting devices decreases and the size of display increases
Solution Approach 1:
The substrate is divided into multiple substrates, and micro light emitting devices are transferred to multiple substrates simultaneously in parallel, rather than transferring to one substrate sequentially. This segmentation approach increases productivity by performing multiple transfer operations at the same time
Solution Approach 2:
Multiple substrates are combined and processed together as a group during the transfer process. The alignment marks and transfer mechanism handle multiple substrates simultaneously, merging what would otherwise be separate sequential operations into a single parallel process
2Productivity
If the pick and place method is used to transfer micro light emitting devices that emit multiple color lights, then all colors can be transferred, but the transfer process requires many times as many transfers as the number of colors
Solution Approach 1:
Multiple substrates containing different color micro light emitting devices are transferred simultaneously in a single operation. Instead of performing separate transfer operations for each color, the method combines all color transfers into one parallel process, reducing both the number of steps and overall complexity
3Area of stationary object
If the area of the light emitting device display apparatus is increased to form a large area display, then the display size increases, but the area of the driving circuit board increases and the transfer process becomes longer
Solution Approach 1:
The large-area substrate is divided into multiple smaller substrates that can be processed and transferred more efficiently. By segmenting the large substrate, the transfer process can handle multiple smaller units simultaneously, reducing the overall manufacturing time despite the large final display area
Solution Approach 2:
The transfer process transitions from a sequential one-dimensional approach (transferring to one substrate at a time) to a parallel multi-dimensional approach (transferring to multiple substrates simultaneously). This dimensional change in the transfer process enables large-area displays to be manufactured without proportionally increasing the transfer time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency of transferring micro light emitting devices to a large-area driving circuit board, reducing manufacturing time and cost while maintaining alignment precision, thus facilitating the production of large-area micro light emitting device arrays.
Implementation Method 1
micro light emitting devices are aligned using a wet alignment method, allowing for efficient bonding to the circuit board through alignment marks
Data Source
AI summary
Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.