Micro-LED Assembly Wiring Layout to Prevent Corrosion Defects
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Solution Overview
Problem
Micro-LED displays face challenges in quickly and accurately transferring millions of micro-LEDs due to corrosion of assembly wiring during the self-assembly process, which can lead to electrical short circuits and assembly defects, especially in step areas where wiring electrodes are vulnerable.
Innovation Solution
The implementation of a display device with alternately arranged first and second assembly wirings on a substrate, featuring insulating layers, planarization layers, and clad layers to prevent corrosion and protect wiring electrodes in step areas, allowing for improved assembly rates and reduced defects through vertical overlap and resistant materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro-LEDs, then assembly speed and productivity are improved, but assembly wiring corrosion occurs leading to electrical short circuits and assembly defects
Solution Approach 1:
The assembly wiring is segmented into multiple functional layers: conductive layer for electrical conduction, insulating layer for corrosion prevention, and planarization layer for surface flattening. This segmentation allows each layer to perform its specific function independently, solving the contradiction between assembly speed and wiring reliability.
Solution Approach 2:
An insulating layer is introduced as an intermediary between the conductive layer and the fluid environment. This intermediary layer prevents direct contact between the conductive layer and corrosive fluid, eliminating corrosion while maintaining the self-assembly process efficiency.
2Ease of manufacture
If step structure is formed in assembly wiring, then wiring functionality is achieved, but wiring electrodes become vulnerable to external shock and damage
Solution Approach 1:
The planarization layer is formed in advance to cover and flatten the step structures of the assembly wiring. This preliminary action protects the vulnerable wiring electrodes before they are exposed to external shocks, preventing damage while maintaining the necessary wiring functionality.
Solution Approach 2:
The planarization layer acts as a cushioning layer that absorbs and distributes external shocks before they reach the wiring electrodes. This beforehand cushioning protects the vulnerable step areas from damage during handling and assembly operations.
3Reliability
If insulating layer is added to prevent corrosion, then wiring reliability is improved, but device structure complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated wiring structure consisting of conductive layer, insulating layer, and planarization layer. This merging approach achieves corrosion protection, electrical conduction, and surface planarization simultaneously, improving reliability without proportionally increasing complexity.
Solution Approach 2:
The assembly wiring structure is designed with multi-functionality: the conductive layer provides electrical conduction, the insulating layer prevents corrosion, and the planarization layer provides both surface flattening and additional protection. This universal design achieves multiple goals with a unified structure.
Data Source
AI summary
A display device according to an embodiment includes a substrate, a first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, an insulating layer disposed on the first assembly wiring or the second assembly wiring, a planarization layer disposed on the first assembly wiring and the second assembled wiring and having an opening, and a light emitting device disposed inside the opening and the first electrode overlapping the first assembly wiring and the second assembly wiring.