Micro Light Source Array with Silicon Sub-Mounts for High-Resolution Display Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The pick-and-place method for transferring micro LEDs decreases productivity as the size of micro LEDs decreases and the size of display devices increases, making it inefficient for manufacturing micro LED display devices.
Innovation Solution
A micro light source array is arranged on silicon sub-mounts with trenches separating them, where light emitting device chips are flip-chip bonded to the sub-mounts, and driving circuits are integrated, allowing for efficient transfer and arrangement on a target substrate using a moving device to adjust the pitch between sub-mounts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick-and-place method is used to transfer micro LEDs, then the transfer process can be performed individually, but the productivity decreases as the size of micro LEDs decreases and the size of display devices increases
Solution Approach 1:
The patent divides the transfer process into two stages: first, multiple silicon sub-mounts are transferred together as a group to the target substrate; second, the individual micro LEDs are extracted from each sub-mount. This segmentation allows batch processing while maintaining individual placement precision, thereby improving productivity without sacrificing transfer accuracy.
Solution Approach 2:
The patent performs preliminary actions by pre-arranging multiple micro LEDs on separate silicon sub-mounts before transfer. The sub-mounts are prepared with micro LEDs already positioned and electrically connected to driving circuits, so that when transferred to the target substrate, they can be directly mounted without further individual handling. This preliminary preparation significantly improves productivity.
2Manufacturing precision
If multiple micro LEDs are transferred individually using pick-and-place, then each micro LED can be precisely positioned, but the manufacturing process becomes inefficient for high-resolution displays
Solution Approach 1:
The patent merges multiple micro LED transfer operations into a single batch process. Multiple silicon sub-mounts, each carrying a micro LED, are transferred together as a group to the target substrate using a single mounting operation. This merging of operations maintains positioning precision while dramatically improving manufacturing efficiency for high-resolution displays.
Solution Approach 2:
The silicon sub-mounts are designed to self-align and self-position on the target substrate through their structural features (such as protrusions fitting into recesses or pitch-matched arrangements). This self-service mechanism eliminates the need for complex individual positioning operations, maintaining precision while improving productivity.
3Ease of manufacture
If micro LEDs are arranged with consistent pitch on silicon sub-mounts, then the transfer process is simplified, but additional structures (trenches and sub-mounts) are required
Solution Approach 1:
The silicon sub-mounts serve multiple functions: they provide mechanical support for micro LEDs, establish electrical connections through integrated driving circuits, enable pitch-matched arrangement on the target substrate, and facilitate batch transfer. This multi-functionality simplifies the overall manufacturing process despite the additional substrate structures required.
Solution Approach 2:
The silicon sub-mounts act as intermediary carriers between the micro LED fabrication process and the final display assembly. They temporarily hold multiple micro LEDs in precise arrangements, enable batch transfer to the target substrate, and can be removed after transfer. This intermediary role simplifies the complex task of transferring individual micro LEDs while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the efficiency of transferring micro LEDs by maintaining a consistent pitch and simplifying the process, improving productivity and yield, especially for high-resolution displays.
Implementation Method 1
Each light emitting device chip from among the plurality of light emitting device chips may include a respective micro light emitting diode (LED). The plurality of light emitting device chips may be configured to emit blue light.
Implementation Method 2
a plurality of color conversion devices provided on the plurality of light emitting device chips, the plurality of color conversion devices being configured to convert a color of light emitted from the plurality of light emitting device chips
Data Source
AI summary
Provided are a micro light source array for a display device, a display device including the micro light source array, and a method of manufacturing the display device. The micro light source array includes: a plurality of silicon sub-mounts provided on a substrate, each silicon sub-mount from among the plurality of silicon sub-mounts corresponding to a respective sub-pixel from among a plurality of sub-pixels of a display device, the plurality of silicon sub-mounts being separated from each other by a plurality of trenches; a plurality of light emitting device chips coupled to the plurality of silicon sub-mounts; and a plurality of driving circuits provided at the plurality of silicon sub-mounts.