Micro Luminescence Element Backlight Module Fabrication
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Solution Overview
Problem
Conventional backlight modules for LCDs require numerous large luminescence elements and additional optical systems, leading to increased manufacturing complexity, cost, and light loss due to refraction, as well as lengthy processing times for mounting elements.
Innovation Solution
A backlight module utilizing very small luminescence elements, approximately 100-300 μm in size, positioned using the Fluidic Self-Assembly process, eliminating the need for additional optical systems and reducing processing time and cost by directly mounting elements on a substrate without additional optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional large luminescence elements (about 1mm by 1mm) are used in backlight modules, then sufficient light output can be achieved, but a large number of elements are required which increases manufacturing complexity and processing time
Solution Approach 1:
The patent changes the size parameter of luminescence elements from conventional 1mm by 1mm to micro-scale dimensions (about 100 micrometers or less). This parameter change allows using fewer elements while achieving the same total light output, thereby reducing manufacturing complexity and processing time without sacrificing illumination intensity
2Area of stationary object
If additional optical systems such as lenses are positioned within LCD to distribute light from luminescence elements, then light can be distributed to a large region, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and removes the additional optical system components (lenses, light guides, etc.) from the backlight module. By using micro-scale luminescence elements directly mounted on the substrate, the patent achieves light distribution across the display area without requiring separate optical components, thereby simplifying the overall structure and reducing manufacturing complexity
Solution Approach 2:
The patent transitions from using large luminescence elements that require optical systems for light distribution to micro-scale elements that inherently distribute light effectively through their reduced size and increased density, representing a dimensional change in the scale of luminescence elements that eliminates the need for additional optical components
3Area of stationary object
If additional optical systems are placed within LCD to distribute light, then light distribution is improved, but the thickness of the LCD cannot be reduced
Solution Approach 1:
The patent removes additional optical system components that would increase thickness. By using micro-scale luminescence elements mounted directly on the substrate, the patent achieves effective light distribution without the need for separate light guides, lenses, or other optical components that would add to the overall thickness of the display device
4Manufacturing precision
If conventional mounting process is used to mount luminescence elements one by one on substrate, then precise positioning can be achieved, but the time required for mounting all elements is very long
Solution Approach 1:
The patent changes the size parameter of luminescence elements to micro-scale dimensions (about 100 micrometers or less). This size reduction allows a smaller number of elements to be mounted, significantly reducing the total mounting time even when using precise positioning methods. The reduced count of elements outweighs the time required for precise positioning of each individual element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient light distribution to a large region without additional optical systems, reducing manufacturing complexity and cost, while minimizing light loss and thickness, thereby enhancing the performance and efficiency of the backlight module.
Implementation Method 1
positioning the luminescence element in at least one cavity formed on a carrier, by the Fluidic Self-Assembly process
Data Source
AI summary
A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.