Micro-Mirror Edge Coupler for Demountable PIC Fiber Alignment

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Solution Overview

Problem

Existing photonic integrated circuits (PICs) face challenges in efficiently coupling optical fibers due to size mismatches between single-mode waveguides and optical fibers, leading to high insertion losses and misalignment issues, particularly with polymer connectors that deform under external loads and temperature changes.

Innovation Solution

A demountable edge coupler with a micro-mirror optical bench (MOB) that includes a mirror array and a base, allowing for separable and reconnectable coupling between optical fiber arrays and PIC devices, using malleable metals like Kovar or stainless steel for precise alignment and reshaping light paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If polymer connector components are used to achieve alignment, then ease of assembly is improved, but dimensional stability deteriorates under temperature changes and external loads

Engineering Contradiction:
Improveease of assemblyVSAvoiddimensional stability
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameter from polymer to metal (Invar or Kovar), fundamentally altering the dimensional stability characteristic while maintaining alignment functionality. This material substitution resolves the contradiction by eliminating polymer deformation under temperature and load while preserving ease of assembly through the same connector mechanism.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material construction by combining metal base materials (Invar or Kovar) with optical components to create a connector that achieves both dimensional stability and optical performance. This composite approach allows the metal substrate to provide thermal and mechanical stability while the optical elements maintain coupling efficiency.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If direct coupling between single-mode waveguides and optical fibers is attempted, then device complexity is reduced, but coupling efficiency deteriorates due to size mismatch

Engineering Contradiction:
Improvecoupling structure complexityVSAvoidinsertion loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces an intermediary coupling mechanism using the metal connector component that facilitates efficient light transfer between waveguides and optical fibers. This intermediary structure acts as a mediator that bridges the size and mode mismatch, enabling effective coupling without requiring complex multi-element systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If permanent optical fiber attachment is used, then connection reliability is improved, but adaptability deteriorates as the connection cannot be demounted or reused

Engineering Contradiction:
Improveconnection reliabilityVSAvoiddemountability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent transforms the static permanent attachment into a dynamic demountable connection using the metal connector that can be repeatedly assembled and disassembled. This dynamic design maintains connection reliability during use while enabling adaptability for reconfiguration, maintenance, and reuse, resolving the contradiction between permanence and versatility.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The edge coupler enables efficient, reliable, and cost-effective optical coupling with improved alignment tolerances, maintaining high data rates and reducing optical losses, while being reusable and adaptable to temperature variations.

Implementation Method 1

Each mirror includes a structured reflective surface profile that turns light between a first light path along a first (horizontal) direction in a plane substantially parallel to the top surface and a second light path along a second (vertical) direction outside the plane

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

the coefficient of thermal expansion (CTE) of polymers is much larger than the CTE of materials that are commonly used in PIC devices. Therefore, temperature cycles cause misalignment between the optical fibers and the optical elements on the PIC devices

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP3871024B1Demountable edge couplers with micro-mirror optical bench for photonic integrated circuits
Publication Date: 2025.12.24 SENKO ADVANCED COMPONENTS INC
  • EP3871024B1 patent drawingFigure 1A~1B
  • EP3871024B1 patent drawingFigure 1C
  • EP3871024B1 patent drawingFigure 2A~2B

AI summary

An edge coupler having an optical bench with a mirror array. Each mirror bends, reflects and/or reshapes incident light. The edge coupler is optically coupled to the optical elements in a PIC chip which direct light to the edge of the PIC chip. The edge coupler provides a demountable, passively aligned coupling between an optical fiber array and the PIC chip. The edge coupler may be a free space edge coupler without any optical element between the mirror array and the optical elements of the PIC chip, or may include grooves each receiving a section of optical fiber with its longitudinal axis along the first light path and terminating substantially at or extending beyond the edge of the edge coupler. The optical fiber array may include an optical fiber connector terminating and supporting the ends of the optical fibers in optical alignment with the mirror array of the edge coupler.