Substrate Post Printing Layout for Faster Micro-Module Population
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods of transfer printing require multiple transfers between a source wafer and a destination substrate, increasing fabrication time and reducing manufacturing throughput due to the need for repeated pickups and placements of components.
Innovation Solution
The use of patterned substrates with substrate posts allows for selective printing of components, where a transfer device picks up components from a source wafer and adheres them to substrate posts on the destination substrate, enabling multiple print steps without intervening pickups, thereby improving manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple transfers are performed between source wafer and destination substrate, then complete component population is achieved, but fabrication time increases and manufacturing throughput decreases
Solution Approach 1:
The destination substrate is pre-patterned with substrate posts before component transfer. These posts are prepared in advance with appropriate spacing and positioning, allowing multiple components to be transferred and placed in a single printing operation rather than requiring multiple sequential transfers. This preliminary preparation enables subsequent batch processing of component placement.
Solution Approach 2:
The destination substrate is divided into multiple regions or areas, each with its own set of substrate posts. This segmentation allows the transfer device to print components to different regions in sequence during a single printing operation, effectively populating the entire substrate without requiring multiple complete transfer cycles between source and destination.
2Quantity of substance
If multiple pickups and placements are performed, then all components are transferred, but manufacturing throughput is reduced
Solution Approach 1:
The printing operation continues to print components to different regions of the substrate without interrupting to return to the source wafer for additional pickups. The transfer device maintains continuous printing action across multiple substrate regions, maximizing productivity by eliminating idle time between pickup and placement operations.
Solution Approach 2:
Instead of performing multiple sequential transfers in a single dimension (one region at a time requiring repeated pickup cycles), the system utilizes spatial arrangement of substrate posts across the substrate surface to enable parallel or sequential placement of multiple components during a single continuous printing operation, effectively adding a spatial dimension to the transfer process.
3Quantity of substance
If repeated pickups from source wafer are performed, then additional components are populated, but fabrication time increases
Solution Approach 1:
The substrate posts are pre-configured with optimal spacing and arrangement to accommodate the complete set of components to be transferred. This preliminary design allows the transfer device to pick up components once and print them all to their respective locations without needing to return to the source wafer, minimizing the duration of the fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing throughput by allowing multiple component print steps on a substrate without the need for repeated pickups from the source wafer, reducing fabrication time and increasing the efficiency of component placement on the destination substrate.
Implementation Method 1
a transfer device picks up components from a source wafer and adheres them to substrate posts on the destination substrate
Data Source
AI summary
A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.