Micro Module Support Structure Reinforces Bonding Pad
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Subscriber identity modules (SIMs) are fragile due to their flexibility, making them susceptible to damage from external forces and pressure, which can cause the semiconductor die to crack during handling or repeated insertion into card readers.
Innovation Solution
A micro module with a support structure positioned adjacent to the semiconductor die on a bonding pad, providing additional support and stress relief, increasing the overall rigidity and reducing the likelihood of damage from external forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If SIM is made thin and flexible to fit in card body, then it can be embedded in card body, but it becomes fragile and susceptible to damage
Solution Approach 1:
The patent applies composite materials by combining the semiconductor die with a support structure made of different materials (such as metal or rigid polymer) that provides enhanced mechanical strength. This composite construction allows the SIM to maintain thin profile while gaining the structural reinforcement needed to prevent cracking and damage during handling and repeated insertions.
2Adaptability or versatility
If SIM is made flexible to fit in thin card body, then it can be embedded in card body, but it bends unintentionally when external force is applied
Solution Approach 1:
The patent applies segmentation by dividing the SIM structure into distinct functional components: a flexible substrate layer that allows bending and adaptation to the card body, and a separate support structure layer that provides structural stability. This segmentation enables each layer to perform its specific function - the substrate provides flexibility while the support structure prevents unwanted bending and maintains structural integrity.
3Volume of moving object
If SIM is made thin to fit in card body, then it can be embedded in card body, but the semiconductor die cracks from pressure during repeated insertion
Solution Approach 1:
The patent applies beforehand cushioning by incorporating a support structure that acts as a protective element before damage can occur. This support structure is pre-installed alongside the semiconductor die to provide mechanical reinforcement and distribute applied pressure, preventing the die from cracking during repeated insertions and handling operations.
4Volume of moving object
If bonding pad is made flexible to match thin card body, then it can be embedded in card body, but it cannot provide adequate support for semiconductor die
Solution Approach 1:
The patent applies merging by combining the bonding pad function with an integrated support structure. Rather than relying solely on the thin bonding pad material, the design merges it with a more robust support structure that provides both the electrical bonding function and the mechanical support needed to hold the semiconductor die securely, eliminating the trade-off between thickness and support capability.
Data Source
AI summary
The present disclosure is directed to a micro module with a support structure. The micro module includes a carrier substrate having contacts and a bonding pad, a semiconductor die, and a support structure. The semiconductor die is positioned on the bonding pad and is electrically coupled to the contacts. The support structure is positioned on the bonding pad and adjacent to the semiconductor die. The support structure reinforces the bonding pad such that the bonding pad is more rigid than flexible. As a result, an external force applied to the micro module is less likely to cause the micro module to bend and damage the semiconductor die.