Overmoulded Micro-Nozzle Insert for High-Pressure Chip Sealing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing micro-fluidic nozzle systems face challenges in securely sealing cuboidal chips within aerosol systems due to their cylindrical or conical form factors and are prone to delamination under high operational pressures, compromising structural integrity.

Innovation Solution

An overmould casing is used to encase the fluidic chip, providing a tight seal and protection, while incorporating features like grooves, flanges, and elastomers to maintain structural integrity and isolate pressures, and a filter retaining wall to prevent hydraulic impulses from affecting the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a cuboidal fluidic chip is used in an aerosol system, then the chip can be manufactured using standard microfabrication processes, but the chip cannot be securely sealed within the aerosol system due to form factor mismatch

Engineering Contradiction:
Improvechip manufacturingVSAvoidsealing reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The system is divided into separate functional components: the cuboidal fluidic chip and the cylindrical aerosol housing. The chip remains cuboidal for manufacturing purposes while the housing provides the cylindrical form factor needed for sealing and integration into the aerosol system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A transition component or adapter is introduced between the cuboidal chip and cylindrical housing to bridge the form factor mismatch. This intermediary element enables secure sealing of the chip within the aerosol system while maintaining the manufacturing advantages of the cuboidal chip design.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If high operational pressures are applied to achieve high-velocity aerosol delivery, then aerosol performance is improved, but the fragile chip becomes delaminated or damaged

Engineering Contradiction:
Improveaerosol velocityVSAvoidchip structural integrity
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The chip is encased in a protective housing structure before being subjected to high operational pressures. This pre-protective enclosure cushions the fragile chip against the damaging effects of high pressure while allowing the system to achieve the necessary high-velocity aerosol delivery.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

A flexible or compliant sealing structure is used to encase the chip, allowing the structure to deform elastically under high pressure without transmitting damaging stress concentrations to the fragile chip. This flexible enclosure maintains sealing integrity while protecting the chip from pressure-induced damage.

Inventive Principle:
Principle #30Flexible shells and thin films

3Strength

If the chip is encased in a protective housing, then structural integrity is improved, but the device complexity increases

Engineering Contradiction:
Improvechip protectionVSAvoidassembly structure
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

Multiple functions are combined into the housing structure: protection of the chip, sealing of the aerosol system, and integration with the aerosol generator. By merging these functions into a single integrated housing, the design provides robust chip protection while minimizing the increase in overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing is designed to serve multiple purposes simultaneously: it acts as a protective enclosure for the chip, provides sealing surfaces for the aerosol system, and serves as a mounting structure for integration into the aerosol generator. This multi-functionality reduces the need for additional separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12496594B2Micro-nozzle
Publication Date: 2025.12.16 THE TECHNOLOGY PARTNERSHIP PLC
  • US12496594B2 patent drawing
  • US12496594B2 patent drawing
  • US12496594B2 patent drawing

AI summary

An insert for a micro-nozzle (10), and a micro-nozzle (10) comprising such insert. The insert comprises a microfabricated fluidic chip (1) having an inlet, an outlet and one or more microfluidic channels connecting the inlet and outlet and an overmould casing (2) overmoulded around the fluidic chip (1) so as to substantially encase the fluidic chip (1), and comprising an inlet in fluid communication with the inlet of the chip and an outlet in fluid communication with the outlet of the chip.