Micro OLED Structure With Discrete DDIC for Higher Pixel Density
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Solution Overview
Problem
Existing OLED-based display systems face challenges in manufacturing large area, high-performance displays due to increased complexity and cost associated with integrating driving electronics onto the backplane, which limits pixel density and image quality.
Innovation Solution
The method involves forming pixel transistors on a silicon backplane with a majority of the driver electronics on a discrete Display Driver Integrated Circuit (DDIC), bonded using a chip-on-flex process, allowing separate manufacturing paradigms for the display and DDIC, and incorporating a multiplexer for higher density data selection interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If driving electronics are integrated onto the backplane, then device functionality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the display system into separate functional modules: the backplane with pixel transistors and the discrete DDIC chip with driving electronics. This segmentation allows each component to be manufactured independently using optimized processes, reducing overall manufacturing complexity while maintaining full device functionality through controlled bonding between modules.
2Adaptability or versatility
If driving electronics are integrated onto the backplane, then device functionality is improved, but manufacturing cost increases
Solution Approach 1:
By segmenting the display into separate backplane and DDIC components, each can be manufactured using cost-optimized processes appropriate to its specific requirements, avoiding the need for expensive multi-functional integration processes.
Solution Approach 2:
The patent introduces a discrete DDIC chip as an intermediary component that handles all driving electronics functions. This mediator allows the backplane to be manufactured simply as a pixel array without complex integration, significantly reducing manufacturing cost while preserving full device functionality through the DDIC interface.
3Adaptability or versatility
If driving electronics are integrated onto the backplane, then device functionality is improved, but pixel density decreases
Solution Approach 1:
Separating the driving electronics into a discrete DDIC chip removes them from the backplane area, freeing up space that can be used to increase pixel density. The backplane can be dedicated entirely to pixel structures without occupying space for integrated driver circuits.
Solution Approach 2:
The patent moves the driving electronics from the two-dimensional backplane surface to a separate three-dimensional component (DDIC chip) that bonds to the backplane. This dimensional transition eliminates the area conflict on the backplane, allowing higher pixel density while maintaining all driving functions.
4Adaptability or versatility
If driving electronics are integrated onto the backplane, then device functionality is improved, but image quality deteriorates
Solution Approach 1:
By separating the pixel array from the driving electronics, the patent allows each component to be optimized for its specific function. The backplane can be manufactured with high precision for pixel uniformity and image quality, while the DDIC handles all electronic control functions, resulting in superior overall image quality compared to integrated designs.
Data Source
AI summary
A method of manufacturing a display system includes forming a display element having a display active area over a silicon backplane, forming a display driver integrated circuit (DDIC), and bonding the display element to the display driver integrated circuit (DDIC). The display active area may include a light emitting diode such as an organic light emitting diode (OLED). Separately forming the display and the display circuitry may simplify formation of the OLED and allow for a higher density control interface between the display and the DDIC.