Micro OLED Display Module Frame Structure for Edge Protection and Cooling

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Solution Overview

Problem

Micro OLED display modules face issues such as edge breakage or scratching of the display chip due to exposure to air during assembly and use, leading to product failure, and poor heat dissipation, especially in large-size modules.

Innovation Solution

A display module design featuring a frame body on the circuit board with a fixing adhesive covering the non-display region of the display panel, and a heat dissipation plate replacing part of the circuit board to protect the display chip and improve thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the display chip is exposed to air during assembly and use, then the assembly process is simple, but the display chip is prone to edge breakage or scratching

Engineering Contradiction:
Improveassembly simplicityVSAvoiddisplay chip integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A frame body is introduced as an intermediary structure between the display panel and the external environment. The frame body forms a protective cavity that isolates the display chip from direct exposure to air and mechanical damage during assembly and use, while still allowing the assembly process to remain relatively simple

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the display chip is exposed to air, then the structure is simple, but heat dissipation is poor

Engineering Contradiction:
Improvestructure simplicityVSAvoidheat dissipation performance
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The frame body is merged with a heat dissipation plate to form an integrated structure. This combination achieves both protective and thermal management functions simultaneously - the frame body provides mechanical protection while the heat dissipation plate conducts heat away from the display chip, improving heat dissipation performance without significantly increasing structural complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The frame body is designed to perform multiple functions: it provides mechanical support, protects the display chip from damage, facilitates heat dissipation, and structural isolation. This multi-functionality addresses both the protection and heat dissipation requirements without requiring separate dedicated components for each function

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If the display chip is exposed to air, then the assembly process is straightforward, but edge breakage and scratching occur

Engineering Contradiction:
Improveassembly easeVSAvoidmechanical damage to display chip
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The frame body is installed beforehand to form a protective cavity structure that cushions and shields the display chip from potential mechanical damage during subsequent assembly operations and use. This preventive measure protects against edge breakage and scratching before they can occur

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design protects the display panel from scratches and edge breakage while enhancing heat dissipation, reducing delamination risks, and extending the product's lifespan.

Implementation Method 1

a fixing adhesive is filled between a peripheral edge of the display panel and the frame body

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

a heat dissipation plate replacing part of the circuit board to protect the display chip and improve thermal management

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12598902B2Display module and display device
Publication Date: 2026.04.07 BOE TECHNOLOGY GROUP CO LTD
  • US12598902B2 patent drawing
  • US12598902B2 patent drawing
  • US12598902B2 patent drawing

AI summary

The embodiment of the present disclosure provides a display module, which includes a circuit board and a display panel provided on a first surface of the circuit board, wherein the display panel includes a display region and a non-display region located at a periphery of the display region; the first surface of the circuit board is also provided with a frame body, the display panel is located within the frame body, a fixing adhesive is filled between a peripheral edge of the display panel and the frame body, and the fixing adhesive also covers the non-display region of the display panel.