Micro-OLED Display Module with Quantum Dot Color Conversion
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Solution Overview
Problem
Current Micro-OLED display modules face limitations in achieving high pixel density due to precision issues in Fine Metal Mask technology and low light transmittance from Color Filter layers, leading to low maximum brightness and cross-color effects.
Innovation Solution
A method for manufacturing high-resolution Micro-OLEDs involving substrate preparation with conductive through-holes, self-aligning anode layer deposition, film encapsulation, and photolithographic processes to form sub-pixel units with metal reflective layers and quantum dot filters, followed by metal oxide layer deposition and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If Fine Metal Mask technology is used for Micro-OLED manufacturing, then the manufacturing process can be completed, but the pixel density is limited to about 800 PPI due to precision limitations
Solution Approach 1:
The patent extracts and removes the Color Filter layer from the display structure, replacing it with quantum dot layers that convert blue light to red and green wavelengths. This elimination of the CF layer removes the alignment precision requirement between CF and OLED, enabling higher pixel densities beyond the 800 PPI limit imposed by Fine Metal Mask technology
Solution Approach 2:
The patent changes the optical conversion mechanism from direct color filtering to quantum dot photoluminescence conversion. By using quantum dots with specific size parameters to emit different wavelengths, the system achieves color separation without requiring precise alignment masks, thereby improving manufacturable pixel density
2Illumination intensity
If a Color Filter layer is used to achieve full colorization, then color display is enabled, but light transmittance drops below 30% causing low maximum brightness
Solution Approach 1:
The patent converts the harmful light absorption by quantum dots into a beneficial process by utilizing photoluminescence conversion. The quantum dots absorb blue light (which would otherwise be wasted) and convert it to red and green wavelengths, transforming optical loss into useful color emission and improving overall brightness efficiency
Solution Approach 2:
The patent employs composite material structures including quantum dot layers combined with transparent conductive oxides and organic light-emitting materials. This composite approach enables efficient light conversion while maintaining high transmittance, achieving full colorization with superior brightness compared to traditional Color Filter systems
3Manufacturing precision
If a Color Filter layer is used for color display, then full colorization is achieved, but cross color effects occur due to alignment shifts between CF layer and OLED
Solution Approach 1:
The patent extracts and removes the Color Filter layer that causes alignment sensitivity issues. By replacing CF with quantum dot layers deposited on the same substrate as the OLED, the system eliminates the inter-layer alignment problem that causes cross-color effects, enabling higher pixel densities without color distortion
Solution Approach 2:
The patent introduces quantum dot layers as an intermediary between the blue OLED and the final red-green-blue color output. These quantum dot layers are deposited in the same processing steps as the OLED, ensuring automatic alignment and eliminating the need for separate CF layer alignment, thereby preventing cross-color effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances pixel density and color purity, preventing light crosstalk and improving display resolution and brightness of Micro-OLEDs beyond previous limitations.
Implementation Method 1
printing to form quantum dot filter structures inside the sub-pixel units by an electrofluid printing technique
Implementation Method 2
depositing a metal reflective layer between two sub-pixel units which are adjacent to each other
Implementation Method 3
manufacturing a metal oxide layer on the surfaces of the metal reflective layer and the sub-pixel units by a deposition technique
Data Source
AI summary
The present invention provides a high-resolution Micro-OLED display module and a manufacturing method thereof. The method for manufacturing the high-resolution Micro-OLED comprises: S1, providing a substrate, and manufacturing light-emitting pixel units on the substrate; S2, encapsulating the light-emitting pixel units by a film encapsulation technique, and forming a film encapsulation layer; S3, manufacturing sub-pixel units on the surface of the film encapsulation layer, and depositing a metal reflective layer between two sub-pixel units which are adjacent to each other; S4, manufacturing a metal oxide layer on the surfaces of the metal reflective layer and the sub-pixel units by a deposition technique, to obtain a high-resolution Micro-OLED matrix; and S5, using a cover plate to encapsulate the high-resolution Micro-OLED matrix produced in step S4, to finish the manufacturing of a high-resolution Micro-OLED.