Micro-optical Device Butt-Coupling for Waveguide Integration
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Solution Overview
Problem
Existing micro-optical devices face challenges in achieving high-performance, low-cost coupling of active optical devices with waveguides and optical fibers, often requiring expensive processing steps and separate packaging of active devices.
Innovation Solution
A micro-optical device configuration where an optoelectronic component and an optical fiber are oriented on a substrate to optically communicate across a single edge, allowing for butt-coupling with an integrated optic chip, which includes an optical waveguide, enabling efficient optical communication without the need for additional expensive processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If active devices are packaged separately and joined to the waveguide with optical fiber, then coupling performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the optoelectronic component, optical fiber, and waveguide onto a single substrate, eliminating the need for separate packaging and joining operations. This integration maintains coupling performance while significantly reducing device complexity and manufacturing cost.
Solution Approach 2:
The patent segments the optical assembly into distinct functional regions on the substrate: an optoelectronic component region, an optical fiber region, and a waveguide region. This segmentation allows each component to be optimized independently while maintaining simple integration through the shared substrate platform.
2Reliability
If grating couplers and embedded microreflectors are used to move optical light out of the waveguide plane, then optical coupling is achieved, but manufacturing cost and processing complexity increase
Solution Approach 1:
The patent extracts the optical coupling function from complex embedded structures (grating couplers and microreflectors) and implements it through a simplified butt-coupling geometry where the optical fiber and waveguide end faces are directly aligned and joined, eliminating the need for additional processing steps.
Solution Approach 2:
Instead of using complex embedded structures to move light out of the waveguide plane, the patent inverts the approach by using a butt-coupling geometry that directly interfaces the waveguide end face with the optical fiber end face, achieving optical coupling through simple alignment and bonding.
3Adaptability or versatility
If multiple processing steps are added to incorporate active devices onto the integrated optic chip, then device functionality is improved, but manufacturing cost increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it supports the optoelectronic component, holds the optical fiber in precise alignment, and provides the waveguide structure. This multi-functionality achieves enhanced device functionality without adding separate processing steps for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-performance, low-cost optical communication between optoelectronic components and optical fibers, reducing loss and simplifying manufacturing processes while allowing for precise alignment and integration of active devices on a single chip.
Implementation Method 1
an optoelectronic component on the substrate oriented to optically communicate across a first region of an edge of the substrate, and an optical fiber on the substrate oriented to optically communicate across a second region of the substrate edge
Implementation Method 2
an optical component oriented to optically communicate with the optoelectronic component and the optical fiber across the first and second edge regions, respectively. The optical component is disposed proximate to the first chip in an optical path between the optoelectronic component and the optical fiber
Data Source
AI summary
The present invention provides a micro-optical device which may be used as an optical pigtailing assembly for waveguides. In an exemplary configuration the assembly includes a first chip which includes an optoelectronic component and an optical fiber. The optical fiber and optoelectronic component are coupled with an optical component, such as one or more waveguides on an integrated optic chip.