Micro-optical Image Stabilizer Using Flip-Chip Bonding
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Solution Overview
Problem
Conventional micro-optical image stabilizers face challenges in fabrication complexity and interference from flexible printed circuits, which affect the movement and positioning of the image sensor, leading to instability in captured images.
Innovation Solution
A micro-optical image stabilizer design featuring a substrate, a carrier moveably disposed on the substrate, anchors, conducting pads, flexible suspensions, and micro-actuators, where the image sensor is coupled using flip chip or wire bonding techniques, allowing for independent signal and actuator paths to stabilize the image sensor without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible printed circuit is used to couple the image sensor to the substrate, then electrical signals can be transmitted, but the flexible printed circuit interferes with the movement of the carrier and affects positioning accuracy
Solution Approach 1:
The patent extracts and removes the flexible printed circuit from the system. Instead of using a flexible printed circuit to transmit signals, the invention uses direct wire bonding or flip-chip bonding techniques to connect the image sensor to the substrate, eliminating the interfering component while maintaining signal transmission capability
Solution Approach 2:
The patent introduces new intermediary connection structures (wire bonds or flip-chip bonds) that serve as mediators between the image sensor and substrate. These intermediaries provide both mechanical support and electrical connection without the interference problems of flexible printed circuits
2Ease of manufacture
If conventional fabrication processes are used with flexible printed circuits, then the image sensor can be coupled, but the fabrication process becomes complex and time-consuming
Solution Approach 1:
The patent merges the signal transmission function and mechanical support function into a single integrated connection structure. By using wire bonding or flip-chip bonding directly on the substrate, the invention combines multiple functions that were previously performed by separate components (flexible printed circuit for signaling and carrier for support), thereby simplifying the overall fabrication process
Solution Approach 2:
The patent replaces the mechanical flexible printed circuit system with a more direct bonding system. Instead of using a flexible circuit board with traces and connectors, the invention uses direct metallurgical or adhesive bonding methods that are more suitable for miniaturized MEMS devices and reduce fabrication complexity
3Reliability
If the image sensor is mounted on a moveable carrier, then image stabilization can be achieved, but the overall size of the image stabilizer increases
Solution Approach 1:
The patent applies the nesting principle by integrating the image sensor directly onto the substrate or carrier structure, eliminating the need for a separate external mounting mechanism. The image sensor is nested within the existing structural framework, utilizing the same space and support structures already present in the design, thereby achieving stabilization without increasing overall size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the fabrication process and ensures stable image capture by decoupling the image sensor's movement from substrate vibrations, improving image stability and reducing the overall size of the image stabilizer.
Implementation Method 1
a micro-actuator coupled to an actuator control circuit for adjusting a position of the carrier relative to the substrate
Data Source
AI summary
The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.