Micro-Package Gas Sensor with Integrated Optical Units
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Solution Overview
Problem
Conventional gas sensors have high manufacturing costs and are bulky due to their complex structure, making them impractical for widespread use.
Innovation Solution
A micro-package gas sensor design comprising a substrate with a light-emitting unit, a light-receiving unit, and a signal-processing unit, where the signal-processing unit is a die protected by a layer, and the entire assembly is housed in a compact package with a through hole for gas detection using optical signals, reducing manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional gas-sensing element with solid electrolyte and printed heater is used, then high sensitivity and versatility are achieved, but manufacturing cost and structural complexity increase
Solution Approach 1:
The patent combines the light-emitting unit, light-receiving unit, and signal-processing unit into a single integrated gas sensor device, eliminating the need for separate modular components. This merging reduces structural complexity while maintaining the optical detection function for gas sensing.
Solution Approach 2:
The invention extracts and eliminates the complex solid electrolyte and printed heater components from the gas-sensing element, replacing them with a simplified optical detection system that uses light emission and reception to detect gas presence, thereby reducing manufacturing complexity.
2Reliability
If a voluminous modularized gas-sensing structure is used, then high conductivity is achieved, but device volume increases
Solution Approach 1:
The patent transitions from a voluminous three-dimensional modular structure to a planar two-dimensional integrated circuit layout on a substrate. The light-emitting unit, light-receiving unit, and signal-processing unit are arranged in a flat configuration, significantly reducing device volume while maintaining electrical connectivity through trace routing.
Solution Approach 2:
The invention nests multiple functional units within a compact substrate area. The light-emitting unit and light-receiving unit are positioned in close proximity on the same substrate, with signal-processing circuits integrated beneath or adjacent to them, creating a space-efficient nested arrangement that minimizes overall device volume.
3Reliability
If platinum wires and nickel connecting pins are used for signal transmission, then high conductivity is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive platinum wires and nickel connecting pins with cost-effective copper traces deposited on the substrate. These trace conductors provide sufficient conductivity for signal transmission at a fraction of the cost of precious metal interconnects, making the device economically viable for mass production.
Solution Approach 2:
The invention substitutes mechanical wire and pin connections with a printed circuit board trace system. Electrical signals are transmitted through conductive patterns deposited directly on the substrate surface, eliminating the need for separate wire bonding or pin insertion processes and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact design lowers packaging costs and simplifies the manufacturing process, resulting in a more practical and cost-effective gas sensor solution.
Implementation Method 1
a gas sensor having a micro-package structure and a method for making the same... uses simplified manufacturing process so as to reduce the packaging costs
Data Source
AI summary
A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.