Micro Pick-Up Array Photolithography Alignment Precision
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Solution Overview
Problem
Current micro pick-up arrays face precision issues due to deformation during demolding, leading to position deviations of up to 1/100, and require thick polymer layers with long curing times, limiting their ability to accurately align and handle dense micro devices.
Innovation Solution
A micro pick-up array featuring a substrate with a pick-up structure formed using photolithography, covered by a soft polymer layer, which reduces deformation and allows for thinner polymer layers, enhancing alignment precision and enabling faster curing and handling of more sophisticated devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polymer material is poured into a mold and cured to manufacture micro pick-up array, then the pick-up array can be manufactured, but deformation occurs during demolding leading to position deviation of approximately 1/100
Solution Approach 1:
The patent changes the material parameter from conventional polymer to a specialized material with modified mechanical properties that reduces deformation during demolding. This parameter change in material composition directly addresses the shape stability issue while maintaining manufacturing precision.
Solution Approach 2:
The invention uses a composite structure combining a substrate with a pick-up array layer made of specially formulated material. This composite approach provides both the structural integrity needed during demolding and the precision required for alignment, resolving the contradiction between shape stability and manufacturing precision.
2Stability of the object's composition
If a considerably thick polymer material layer is used in the micro pick-up array, then the array structure is stable, but a long period of time is needed for curing
Solution Approach 1:
The patent modifies the material composition parameters to achieve faster curing kinetics. By changing the chemical composition and curing mechanism of the pick-up array material, the curing time is significantly reduced while maintaining adequate structural stability through optimized material properties rather than increased thickness.
3Ease of manufacture
If the pick-up array is manufactured with conventional methods, then manufacturing is straightforward, but the array cannot precisely align with dense dies due to deformation
Solution Approach 1:
The invention changes key material parameters including composition, viscosity, and curing characteristics to enable precise alignment. These parameter modifications allow the material to maintain dimensional accuracy during manufacturing while remaining workable through standard fabrication processes, thus preserving ease of manufacture achieving high alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves precise alignment and increased yield by minimizing deformation and curing time, allowing for the efficient picking up of smaller, more complex micro devices with improved position accuracy and reduced processing time.
Implementation Method 1
The pick-up structure is formed through a photolithography process
Data Source
AI summary
A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.