Micro Pixel Package Interconnects for Low-IR-Drop Displays
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Solution Overview
Problem
Existing display modules face challenges with high current-resistance (IR) drop due to power lines formed on a module substrate, which affects the efficiency and consistency of voltage transmission to micro pixel packages in self-emitting displays.
Innovation Solution
The display module incorporates internal connection lines with higher electron mobility than traditional voltage lines, which are formed within micro pixel packages to connect adjacent micro pixel packages, reducing IR drop and ensuring consistent voltage delivery across the display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power lines are formed on a module substrate to connect micro pixel packages, then the display module structure is simplified and ease of manufacture is improved, but current-resistance (IR) drop increases and voltage transmission consistency deteriorates
Solution Approach 1:
The patent transitions from planar voltage lines on the module substrate to three-dimensional stacked micro pixel packages with vertical internal connection lines. This dimensional change allows voltage transmission to occur both horizontally (via module substrate lines) and vertically (via internal connection lines within packages), reducing the overall current path length and minimizing IR drop while maintaining manufacturing simplicity
Solution Approach 2:
The patent embeds voltage lines and control lines within the internal structure of micro pixel packages, nesting the connection infrastructure inside the functional units themselves. This nesting approach reduces the need for extensive external routing on the module substrate, thereby reducing total line length and IR drop while keeping the overall module structure compact and manufacturable
2Reliability
If some power lines are formed in micro pixel controller or micro pixel package, then current-resistance (IR) drop is reduced, but device complexity increases and manufacturing difficulty worsens
Solution Approach 1:
The patent divides the display module into discrete micro pixel packages, each containing its own internal connection lines and control circuitry. This segmentation allows voltage transmission to be optimized at the package level (reducing IR drop) while maintaining modular architecture that simplifies overall system management and manufacturing through standardization
Solution Approach 2:
The patent designs micro pixel packages with universal internal connection structures that serve multiple functions: power delivery, signal transmission, and inter-package communication. This multi-functionality reduces the need for separate dedicated lines for each purpose, thereby reducing overall complexity while maintaining effective voltage transmission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes IR drop and allows for consistent voltage transmission to micro pixel controllers and inorganic light-emitting elements, enhancing display performance and preventing luminance degradation and Mura effects.
Implementation Method 1
an internal connection line disposed in the second substrate and configured to electrically connect a first voltage line of the plurality of voltage lines that is electrically connected to a first micro pixel package of the set of micro pixel packages that are adjacent to each other in the first direction and a second voltage line of the plurality of voltage lines that is electrically connected to a second micro pixel package
Implementation Method 2
a plurality of inorganic light-emitting elements provided on the second substrate
Data Source
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AI summary
A display module is provided. The display module includes a plurality of pixels, a first substrate, a plurality of micro pixel packages provided on the first substrate, and a plurality of voltage lines electrically connected between a set of micro pixel packages of the plurality of micro pixel packages that are adjacent to each other in a first direction. Each of the plurality of micro pixel packages includes a second substrate, a plurality of inorganic light-emitting elements provided on the second substrate, and a micro pixel controller provided on the second substrate and configured to control the plurality of inorganic light-emitting elements.