Micro Probe Assembly Alignment Layer Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing probe technologies face limitations in reducing the distance between contacts, securing probes during assembly and repair, and maintaining current handling ability, particularly due to the need for protruding structures that impact spacing and manufacturing complexity.
Innovation Solution
The design features micro probes with a lower contact end, an upper contact end, and a curved intermediate region of uniform thickness, including an angle stop, which allows for secure insertion and alignment without protruding structures, enabling a tighter array and increased current handling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protruding structures (flattened swaged region, tapered region, protruding notch) are used to secure the probe in place, then the probe is prevented from sliding through the hole, but the spacing between adjacent probes is increased and current handling ability is reduced
Solution Approach 1:
The patent transitions from using lateral protruding structures (flattened swaged regions, tapered regions, protruding notches) to secure probes to using a vertical dimension solution - a recess in the lower die that receives the probe tip. This dimensional change eliminates the need for lateral protrusions that increase pitch, allowing probes to be secured without increasing the horizontal spacing between them.
Solution Approach 2:
The patent extracts the probe security function from the probe body itself and relocates it to the lower die structure. Instead of modifying the probe with protruding features, the security mechanism is taken out and implemented as a recess in the lower die, allowing the probe to have a uniform cross-section throughout.
2Reliability
If protruding structures are used to secure the probe, then the probe position is fixed, but manufacturing complexity increases
Solution Approach 1:
The security function is extracted from the probe manufacturing process and relocated to the lower die. The recess in the lower die is formed as a single integrated feature during die manufacturing, eliminating the need for complex multi-step probe fabrication processes required to create flattened swaged regions, tapered sections, or protruding notches.
Solution Approach 2:
The patent segments the security function from the probe body and places it in the lower die structure. This segmentation allows the probe to be manufactured as a simple uniform-cross-section component while the lower die provides the securing mechanism through its recess feature, simplifying both manufacturing processes.
3Length of moving object
If the distance between contacts is reduced to accommodate tighter probe arrays, then more contacts fit in the same space, but existing probe technologies cannot achieve this reduction
Solution Approach 1:
The patent removes the protruding security structures from the probe design, allowing the probe to have a uniform cross-section throughout. This extraction of the security function to the lower die recess enables tighter probe spacing without the complexity of creating specialized probe geometries, thereby reducing the pitch between contacts.
Solution Approach 2:
By moving the security mechanism to the vertical dimension (recess in lower die) rather than using lateral protrusions, the patent enables tighter horizontal spacing between probes. This dimensional relocation of the security function eliminates the need for increased probe width or length that would prevent closer spacing.
Data Source
AI summary
Embodiments of the present invention improve probes and probe assemblies. In one embodiment, the present invention includes a probe test head comprising a plurality of novel probes inserted in an array of holes in upper and lower dies of the assembly. The novel assembly includes a novel alignment layer for easy repair and maintenance of the probes.