Micro Resistor Fabrication Using Laser-Trimming on Segmented Layers
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Solution Overview
Problem
The existing methods for fabricating small-size resistors are time-consuming and costly, necessitating a more efficient approach to meet the demand for smaller electronic components in devices like smartphones and tablets.
Innovation Solution
A method involving a substrate with defined product regions, where a first resistance layer is formed using screen printing or sputtering and divided into smaller layers using a laser, with patterns trimmed to achieve specific resistance values, reducing fabrication time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If typical fabrication methods are used for small-size resistors, then the resistors can be produced with required precision, but the fabrication time and cost increase significantly
Solution Approach 1:
The patent divides the substrate into multiple product regions and forms resistance layers in a sequential manner across different regions. This segmentation allows parallel processing of multiple resistors while maintaining precise control over each individual resistor's fabrication, thereby improving overall productivity without sacrificing manufacturing precision.
Solution Approach 2:
The patent performs preliminary actions by defining multiple product regions and preparing the substrate in advance with electrode structures before forming the resistance layers. This preliminary setup enables more efficient subsequent processing steps, reducing total fabrication time while maintaining the ability to produce precise small-size resistors.
2Manufacturing precision
If typical fabrication methods are used for small-size resistors, then the resistors can be produced with required precision, but the fabrication cost increases
Solution Approach 1:
The patent merges multiple fabrication operations into a unified process flow. By combining the formation of multiple resistance layers across different product regions in a coordinated manner, and integrating electrode formation with resistance layer fabrication, the process reduces the number of separate manufacturing steps, lowering fabrication cost while maintaining precision through controlled processing.
Solution Approach 2:
The patent creates a universal fabrication process that can produce multiple different resistors with various resistance values from a single substrate. The method uses common materials and processes (screen printing or sputtering for resistance layers, laser trimming for all resistors) that can be applied universally across different product regions, reducing per-unit fabrication cost while maintaining precise control over each resistor's characteristics.
3Area of moving object
If smaller resistor sizes are produced, then the electronic product size can be reduced, but the fabrication complexity increases
Solution Approach 1:
The patent segments the fabrication process into standardized steps that can be applied to multiple small resistors simultaneously. By dividing the substrate into product regions and using consistent processing methods across all regions, the complexity of fabricating small resistors is managed through systematic segmentation rather than individual complex procedures for each resistor.
Solution Approach 2:
The patent employs laser trimming technology to replace traditional mechanical methods for adjusting resistor values. This substitution enables precise control over small resistor dimensions and resistance values through non-contact laser processing, reducing fabrication process complexity while maintaining the ability to produce very small resistors with accurate specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly decreases the fabrication time and cost of micro resistors while maintaining precision, enabling the production of smaller electronic components efficiently.
Implementation Method 1
forming a first resistance layer on the substrate by using a screen printing process or a sputtering process
Implementation Method 2
forming a first resistance layer on the substrate by using a screen printing process or a sputtering process
Implementation Method 3
dividing the first resistance layer into a plurality of second resistance layers, in which each of the product regions encompasses one of the second resistance layers
Implementation Method 4
trimming a pattern of each of the second resistance layers in accordance with a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value
Data Source
AI summary
A method for fabricating a micro resistance layer and a method for fabricating a micro resistor are provided. The method for fabricating a micro resistance layer includes: providing a substrate; forming a first resistance layer on the substrate by using a screen printing process or a sputtering process; dividing the first resistance layer into second resistance layers, wherein each one of the product regions includes a second resistance layer, and an area of each one of the product regions is smaller than 0.4*0.2 mm2; and trimming the second resistance layer of each one of the product regions according to a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value. The method for fabricating a micro resistor uses the method for fabricating a micro resistance layer for fabrication of the micro resistor.