Micro-ring waveguide heater with tapered arms

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Solution Overview

Problem

Achieving temperature uniformity and reducing heat loss in micro-ring waveguides is challenging due to dimensional differences between heater arms and the heater ring, leading to non-uniform temperature distribution and reduced efficiency in semiconductor-based optical waveguides.

Innovation Solution

The use of non-linearly tapered heater arms, where the width increases gradually and then more rapidly as it moves away from the heater ring, improves temperature uniformity and reduces heat loss by matching the heater arm width to the wall thickness of the heater ring, ensuring consistent temperature across the micro-ring waveguide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heater arms have constant width, then manufacturing is simple, but temperature uniformity is poor and heat loss increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheater arm geometry complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heater arm width is varied along its length, being narrower near the heater ring and wider toward the contact pad. This local variation in geometry allows different sections of the heater arm to perform different functions: the narrower section reduces heat loss at the heater ring interface while the wider section improves electrical contact and heat dissipation at the contact pad, thereby achieving temperature uniformity without requiring complex manufacturing processes.

Inventive Principle:
Principle #3Local quality

2Loss of energy

If heater arm width is increased to reduce heat loss, then heating efficiency improves, but temperature uniformity deteriorates

Engineering Contradiction:
Improveheat lossVSAvoidtemperature uniformity
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

The width parameter of the heater arm is changed continuously along its length rather than being constant. The width increases from the heater ring toward the contact pad, which changes the thermal and electrical characteristics along the heater arm. This parameter variation allows optimization of both heat loss reduction and temperature uniformity by matching the local thermal requirements at different positions along the heater arm.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If heater arm width matches heater ring wall thickness, then temperature uniformity improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvetemperature uniformityVSAvoidheater arm width control precision
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The heater arm is designed with distinct geometric segments: a first width section near the heater ring and a second width section toward the contact pad. This segmentation allows each section to be optimized independently for its specific function, reducing the overall manufacturing precision requirements compared to a uniform width design that would require precise control throughout the entire heater arm length.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances temperature uniformity along the heater ring, improving the performance of micro-ring waveguides by maintaining optimal temperature control and reducing heat loss, thereby increasing the efficiency of the heating mechanism.

Implementation Method 1

A heater is over the micro-ring waveguide. The heater includes a heater ring, a first heater contact pad, a first heater arm extending from the heater ring to the first heater contact pad

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20240329317A1Micro-ring waveguide heater
Publication Date: 2024.10.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240329317A1 patent drawing
  • US20240329317A1 patent drawing
  • US20240329317A1 patent drawing

AI summary

An integrated chip including a semiconductor waveguide layer over a base dielectric layer. The semiconductor waveguide layer forms a bus waveguide and a micro-ring waveguide alongside the bus waveguide. A heater is over the micro-ring waveguide. The heater includes a heater ring, a first heater contact pad, a first heater arm extending from the heater ring to the first heater contact pad, a second heater contact pad, and a second heater arm extending from the heater ring to the second heater contact pad. A first contact is coupled to the heater at the first heater contact pad. A second contact is coupled to the heater at the second heater contact pad. A width of the first heater arm increases non-linearly as a distance from the heater ring increases.