Micro-scaled Heat Exchanger for High Flux Thermal Management
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Solution Overview
Problem
Conventional air cooling methods for electronic components, such as CPUs, are inadequate for high heat flux dissipation due to limited thermal resistance and space constraints, leading to inefficiencies in heat transfer and temperature uniformity.
Innovation Solution
The development of fluid-cooled micro-scaled heat exchangers with microchannels, micro-porous structures, or micro-pillars, optimized for high aspect ratios and specific geometric parameters, which enhance heat transfer area per unit volume and maintain temperature uniformity across the X-Y direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional air cooling methods with heat sinks are used, then heat dissipation is achieved, but thermal resistance is high and surface area requirements increase
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a fluid delivery system with channels that direct coolant flow across the heat spreader surface. This hydraulic approach enables more efficient heat removal through liquid convection, reducing thermal resistance while maintaining compact dimensions.
Solution Approach 2:
The invention introduces micro-scale vertical channels (depth dimension) into the heat spreader structure, creating micro-pillars or micro-cavities that extend downward. This adds a vertical heat transfer dimension, increasing effective heat exchange area without expanding the horizontal footprint, thereby reducing thermal resistance.
2Loss of energy
If heat sink surface area is increased to improve heat dissipation, then heat transfer capability improves, but device size and space requirements increase
Solution Approach 1:
The patent creates micro-scale vertical structures (micro-pillars or micro-cavities) extending downward from the heat spreader surface. This vertical dimension multiplication provides additional heat transfer area without increasing the horizontal footprint, enabling improved heat dissipation within compact space constraints.
Solution Approach 2:
The invention employs a micro-porous or micro-structured surface layer with high surface area to volume ratio. This porous structure provides extensive heat exchange area within a thin profile, allowing effective heat transfer without requiring large external dimensions.
3Loss of energy
If traditional heat spreader configuration is used, then heat distribution is achieved, but temperature uniformity in X-Y direction is poor
Solution Approach 1:
The patent implements a non-uniform micro-structure distribution pattern where micro-pillars or micro-cavities are strategically positioned and varied in density across different regions of the heat spreader. This local variation optimizes heat distribution by providing enhanced cooling capacity in high-heat-flux regions while maintaining temperature uniformity across the entire surface.
Solution Approach 2:
The invention introduces fluid flow dynamics through the micro-channel network, creating variable flow rates and residence times in different regions. This dynamic fluid distribution adapts to local heat generation patterns, enhancing temperature uniformity by directing more coolant to hotter areas while maintaining overall thermal balance.
4Loss of energy
If larger heat sinks are used to accommodate increased heat load, then heat dissipation capacity improves, but acoustic noise from larger fans increases
Solution Approach 1:
The patent replaces fan-driven air cooling with pump-driven liquid cooling. The liquid coolant efficiently absorbs and transports heat away from the heat spreader, eliminating the need for high-speed fans and their associated acoustic noise, while maintaining superior heat dissipation capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These micro-scaled heat exchangers effectively remove high heat fluxes exceeding 100 W/cm2 with low thermal resistance and improved temperature uniformity, utilizing a spreader region and micro-scaled region configuration to optimize heat transfer and fluid flow, reducing the need for large surface areas and minimizing acoustic noise.
Implementation Method 1
Heat fluxes exceeding 100 W/cm2 can be removed using the currently disclosed micro-scaled heat exchanger... with low thermal resistance
Implementation Method 2
A liquid pumped cooling system can remove more heat with considerably less flow volume... These results are reached with significantly less acoustic noise
Data Source
AI summary
A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.