Micro SD Card Substrate Manufacturing with Chamfered Perimeter
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Solution Overview
Problem
Conventional manufacturing techniques for Micro SD cards are inefficient, with low production rates and inability to customize cards, such as printing decorative designs or electrical configuration, due to limitations in existing fabrication equipment.
Innovation Solution
A method for manufacturing cards with physical dimensions compliant with the Micro SD standard using a substrate with predetermined thickness, involving steps like defining a card perimeter, forming a chamfer, and optionally including pre-cutting, punching, and thinning to create a grip area, allowing for customization and improved production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional molding techniques are used to manufacture Micro SD cards, then the cards can be produced with standard dimensions, but the production rate is too low and customization capabilities are limited
Solution Approach 1:
The manufacturing process is divided into two distinct phases: a first phase using conventional molding techniques to produce the card body with standard dimensions, and a second phase using specialized equipment to perform customization operations such as printing decorative designs and electrical configuration. This segmentation allows each phase to be optimized independently, achieving both high production rate and customization capability.
Solution Approach 2:
The card body is pre-manufactured using conventional molding techniques before customization operations are performed. This preliminary action establishes the base product with standard dimensions and properties, allowing subsequent customization steps to be added without compromising the efficiency of the initial production process.
2Ease of manufacture
If conventional fabrication equipment is used, then existing processes can be maintained, but the equipment cannot carry out all necessary technological steps for customization
Solution Approach 1:
The manufacturing system is designed to perform multiple functions across two phases: the first phase uses conventional equipment for basic card body production, while the second phase employs specialized equipment for customization operations including printing decorative designs and electrical configuration. This multi-functional approach allows the system to handle both standard production and customization requirements.
Solution Approach 2:
An intermediary step is introduced between the conventional molding process and the customization operations. This intermediary phase allows the card body to be prepared in advance and then subjected to customization treatments, enabling the integration of different manufacturing techniques without requiring a complete system redesign.
3Adaptability or versatility
If the card is extracted from the substrate after all processing steps, then the card can be customized, but the production time increases
Solution Approach 1:
The card body is pre-formed and prepared on the substrate before extraction, allowing customization operations to be performed efficiently after separation. This preliminary preparation reduces the time required for subsequent customization steps by having the base card ready in the correct configuration.
Solution Approach 2:
The manufacturing process is segmented into preparation phase (on substrate) and customization phase (after extraction), allowing each phase to be optimized independently and reducing overall production time by avoiding unnecessary delays in either phase.
Data Source
AI summary
A method for manufacturing a card (102) based on a substrate (101), the method comprising a step of defining the perimeter of the card (102) within the substrate (101), the method also comprising a step of chamfering on a portion of the perimeter of the card (102) so that on completion of the perimeter definition and chamfering steps the physical dimensions of the card (102) are compliant with the parameters A, Ai, B, Bj, C2, C3, and Rm defined by that Micro SD card standard designated V3.00, wherein: i=1, 6 . . . 8; j=1, 4, 10, 11, x, y (the pair [x,y] being equal to [6,9] or to [14,15]); and m=1 . . . 6, 17 . . . 19, the physical dimensions of the card (102) also being compliant with the parameter A9 of the standard when x=6 and y=9.