Micro Semiconductor Stacked Structure for High-Resolution Micro LED Displays
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing the minimum line width and increasing pixel density in micro LED displays due to cost and technical bottlenecks, limiting the advancement of high-resolution displays in a limited area.
Innovation Solution
A micro semiconductor stacked structure is developed, where multiple stacked structures are aligned vertically, each comprising a substrate and micro semiconductor devices connected to a conductive pattern layer, allowing for a decrease in pixel area and increase in pixel density by aligning target regions along the vertical direction, and using active circuits and electronic connecting members for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If micro LEDs are arranged in a plane to form pixels, then display functionality is achieved, but the pixel area increases and resolution is limited
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement of micro LEDs to three-dimensional stacked structure. Multiple sub-pixel layers (red, green, blue micro LEDs) are stacked vertically along the thickness direction, with each layer containing micro LEDs of a specific color. This vertical stacking enables color synthesis while dramatically reducing the horizontal pixel area, thereby achieving higher resolution displays.
2Manufacturing precision
If more pixels are arranged in a limited area to increase resolution, then display density improves, but manufacturing cost and technical difficulty increase
Solution Approach 1:
The patent segments the display structure into multiple independent sub-pixel layers, where each layer contains micro LEDs of a specific color (red, green, or blue). Each sub-pixel layer can be manufactured and tested independently, allowing for modular production. This segmentation simplifies the manufacturing process compared to producing complete RGB pixels in a single step, thereby reducing technical difficulty and cost.
Solution Approach 2:
The patent implements a nested structure where multiple sub-pixel layers are stacked one on top of another, with each layer containing micro LEDs of a specific color. The sub-pixels are nested within the vertical space, allowing color synthesis through spatial stacking. This nested arrangement maximizes the use of limited display area while maintaining manageable manufacturing complexity.
3Length of moving object
If the minimum line width is reduced to achieve smaller devices, then device size decreases, but manufacturing capability is limited by cost and equipment investment
Solution Approach 1:
Instead of continuing to reduce the horizontal dimensions (line width) of micro LEDs, the patent utilizes the vertical dimension by stacking multiple sub-pixel layers. This approach allows device miniaturization without requiring further reduction in manufacturing line width, thereby avoiding the associated cost and equipment investment barriers.
Data Source
AI summary
A micro semiconductor stacked structure includes at least two stacked structure array units, wherein one stacked structure array unit is stacked on the other stacked structure array unit. In particular, the stacked structure array unit is stacked on the other stacked structure array unit along a vertical direction. Each stacked structure array unit includes a substrate, a conductive pattern layer disposed on the substrate, and a plurality of micro semiconductor devices disposed on the substrate and electrically connected to the conductive pattern layer.