Micro-Sensor Package With Through-Chip Via and EMI Shielding Shim
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Solution Overview
Problem
Current sensor packaging technologies for MEMS microphones in aeroacoustic applications are not cost-effective and fail to meet the requirements for ultra-flush installation, EMI resistance, and precise positioning, necessitating a robust, EMI-resistant, and ultra-thin micro-sensor package solution.
Innovation Solution
A micro-sensor package is developed that includes a micro-sensor with a through-chip via connected to a printed circuit board (PCB) via a conductive bonding agent, with a shim surrounding the sensor for EMI protection and precise positioning, and a method of assembly that ensures the sensor is bonded to the PCB with minimal disruption to the surface smoothness, achieving an ultra-flush installation and EMI resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional sensor packaging is used for MEMS microphones, then the sensor can be installed, but it cannot achieve ultra-flush installation with minimal disruption to surface smoothness
Solution Approach 1:
The sensor package is divided into a sensor element and a separate mounting structure with a mounting surface that interfaces with the host structure. This segmentation allows the mounting surface to be optimized for flush installation while the sensor element maintains its functional integrity.
Solution Approach 2:
A mounting structure acts as an intermediary between the sensor element and the host structure. This intermediary provides a dedicated mounting surface that achieves ultra-flush installation while accommodating the sensor element through various coupling methods.
2Reliability
If the sensor is packaged to be robust and EMI resistant, then reliability improves, but the package complexity increases
Solution Approach 1:
The mounting structure serves multiple functions simultaneously: it provides mechanical support, creates the mounting surface for flush installation, and offers EMI shielding. This multi-functionality reduces overall package complexity while maintaining reliability.
Solution Approach 2:
The mounting structure may utilize composite materials or combinations of materials that provide both mechanical strength and EMI shielding properties, achieving robustness and EMI resistance without excessive complexity.
3Measurement precision
If hundreds or thousands of array locations are used to cover sound propagation paths, then measurement precision improves, but device complexity and cost increase significantly
Solution Approach 1:
The patent replaces traditional mechanical array structures with a streamlined sensor package design that achieves equivalent or superior measurement precision through optimized sensor placement and integration, reducing the number of required array locations.
4Adaptability or versatility
If the sensor package is made ultra-thin for individual sensors, then adaptability to complex surfaces improves, but manufacturing precision requirements increase
Solution Approach 1:
The design transitions from thick traditional packages to ultra-thin profiles by redistributing functional elements across different dimensions, achieving adaptability to complex surfaces while managing manufacturing precision through strategic design choices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-fidelity noise source location arrays in previously inaccessible locations, improving measurement fidelity and enabling deployment on complex surfaces like airplane fuselages, while maintaining robustness and EMI resistance.
Implementation Method 1
a conductive bonding agent, with a method of assembly that ensures the sensor is bonded to the PCB
Implementation Method 2
bonded to the PCB with an adhesive that surrounds and seals the conductive bonding agent
Implementation Method 3
with a shim surrounding the sensor for EMI protection
Data Source
Figure 1a
Figure 1b
Figure 1c
AI summary
A micro-sensor package (10) is provided that includes a micro-sensor (12) and printed circuit board (PCB) (14), or that includes an array of micro-sensors and PCB (14). The micro-sensor (12) includes a first substrate (16) having opposing front and back surfaces, a sensing element (12) on the front surface of the first substrate (16), and a through-chip via (30, 32) disposed within the first substrate (16) and electrically connected to the sensing element (12). The PCB (14) includes a second substrate (38) to which the back surface of the first substrate (16) is bonded. The second substrate (38) defines a recess (44) within which a bond pad (42) is disposed, and the through- chip via (30, 32) of the micro-sensor (12) is electrically connected to the bond pad (42) of the PCB (14). The micro-sensor package (10) may further include a shim (48) bonded to the PCB (14), and that may surround an outer boundary of the micro-sensor (12) and have approximately the same thickness as the micro-sensor (12).