Micro-structured Contact Cleaning Surface for Submicron Particle Removal

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Solution Overview

Problem

Current contact cleaning technologies are ineffective in removing microscopically sized contaminating particles from sensitive web surfaces, such as those used in plastic electronics and photovoltaics, as they cause interfacial reactions that damage the thin coatings, and existing systems struggle to achieve submicron-level cleanliness without damaging the substrate.

Innovation Solution

A microscopically roughened contact cleaning surface with indentations of varying sizes and shapes is used to increase the surface area contact with contaminating particles, enhancing the collection and removal of particles through increased van der Waals forces, and can be electrostatically charged for improved efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If contact cleaning technology is used to remove microscopically sized particles from web surfaces, then particle removal capability is improved, but interfacial reaction damage occurs to the thin coated layers

Engineering Contradiction:
Improveparticle removal capabilityVSAvoidinterfacial reaction damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The cleaning surface is microscopically roughened with indentations of varying sizes and shapes, creating local variations in surface topology. This local quality enhancement allows the cleaning surface to engage more effectively with microscopically sized particles while distributing the mechanical stress across multiple contact points, thereby reducing interfacial reaction damage to the thin coated layers.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cleaning surface transitions from a two-dimensional smooth plane to a three-dimensional micro-structured topography with indentations of varying depths and diameters. This dimensional change increases the effective surface area contact with particles while the distributed contact geometry reduces concentrated stress and interfacial reactions that would damage the substrate coating.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If smooth cleaning surfaces are used, then substrate damage is minimized, but particle collection and removal efficiency is reduced

Engineering Contradiction:
Improvesubstrate damageVSAvoidparticle removal efficiency
Core Design Contradiction:
Object-affected harmful factorsVSProductivity

Solution Approach 1:

The cleaning surface incorporates local quality variations through microscopically roughened indentations that are strategically distributed across the surface. These localized features enhance particle capture efficiency at each contact point while the overall surface geometry maintains sufficient compliance to minimize substrate damage.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The cleaning surface combines different surface topologies within a single structure - smooth regions for substrate compliance and microscopically roughened regions for particle engagement. This composite surface structure integrates the benefits of both smooth and rough surfaces, achieving high particle removal efficiency while maintaining substrate protection.

Inventive Principle:
Principle #40Composite materials

3Ease of operation

If existing contact cleaning systems are used, then cleaning operation is simple, but submicron-level cleanliness cannot be achieved

Engineering Contradiction:
Improvecleaning operation simplicityVSAvoidsubmicron-level cleanliness
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The cleaning surface parameters are modified by introducing microscopically roughened indentations with specific size distributions and depth ranges. These parameter changes enable the system to achieve submicron-level cleanliness by matching the dimensional characteristics of the indentations to the size range of contaminating particles, while the overall system operation remains simple and maintains ease of use.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microscopically roughened surface significantly increases the collection and removal of contaminating particles by up to 50% compared to smooth surfaces, ensuring defect-free coatings and improved process yields while minimizing substrate damage.

Implementation Method 1

enhancing the collection and removal of particles through increased van der Waals forces

Methodology Applied
Scientific Effectvan der Waals forces: Van der Waals Force

Implementation Method 2

can be electrostatically charged for improved efficiency

Methodology Applied
Scientific EffectElectrostatic charge: Electrostatics

Data Source

PatentUS9592536B2Surface cleaning
Publication Date: 2017.03.14 ITW LTD
  • US9592536B2 patent drawing
  • US9592536B2 patent drawing
  • US9592536B2 patent drawing

AI summary

There is herein described an improved contact cleaning surface and an improved method for cleaning surfaces. More particularly, there is described a contact cleaning surface comprising a micro-structured surface adapted to collect and/or remove microscopically sized contaminating material from a contaminated surface.