Micro Device Mass Transfer with Localized Heating and Rolling Bonding
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Solution Overview
Problem
The existing micro light-emitting diode display fabrication processes face bottlenecks due to varying processing times in die transfer and bonding, which affect throughput and can damage non-bonding regions with whole-surface heating methods.
Innovation Solution
A micro device mass transfer equipment with a base stage, moving stage, substrate stage, laser device, rolling and pressing mechanism, and heating mechanism, allowing for staged transfer and bonding processes to improve alignment and bonding yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If whole-surface heating method is used for bonding, then bonding process can be completed, but operational and electrical properties of non-bonding region are affected
Solution Approach 1:
The patent implements localized heating by positioning the heating mechanism to heat only the contact region between the moving stage and rolling and pressing mechanism, rather than heating the entire substrate surface. This localized approach enables bonding to occur only where needed while preserving the operational and electrical properties of non-bonding regions.
Solution Approach 2:
The bonding process is segmented into discrete stages: transfer stage, bonding stage, and inspection stage. The heating mechanism operates only during the bonding stage at the contact region, separating the heating function from the entire substrate surface and applying thermal energy only where and when required for bonding.
2Productivity
If die transfer and bonding are performed simultaneously, then throughput is improved, but process control becomes difficult due to varying processing times
Solution Approach 1:
The patent divides the fabrication process into three independent but sequential stages: transfer stage (moving stage transfers micro devices), bonding stage (heating mechanism activates at contact region), and inspection stage. This segmentation allows each stage to be optimized independently while maintaining overall process continuity and control.
Solution Approach 2:
The moving stage continuously moves along its moving path, and the heating mechanism is positioned to activate at the contact region as the moving stage passes through, ensuring continuous bonding action without interrupting the flow of substrates. This maintains high throughput while enabling precise control of the bonding process.
3Manufacturing precision
If staged transfer and bonding process is implemented, then transfer accuracy and bonding yield are improved, but device complexity increases
Solution Approach 1:
The moving stage serves multiple functions: it transports substrates along the moving path, positions substrates for transfer, and facilitates bonding by creating the contact region with the rolling and pressing mechanism. The heating mechanism similarly provides both localized heating for bonding and serves as a reference for positioning. This multi-functionality reduces the need for separate dedicated components.
Solution Approach 2:
The contact region acts as an intermediary zone where the moving stage and rolling and pressing mechanism interact to transfer and bond micro devices. This contact region serves as the focal point for both mechanical transfer and thermal bonding processes, coordinating multiple functions at a single location and simplifying the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances transfer accuracy and bonding yield while preventing damage from unexpected heat flows, improving overall production capacity and efficiency.
Implementation Method 1
a laser device (130), which is adapted to move relative to the substrate stage and emits a laser beam (LB) toward the substrate stage
Implementation Method 2
The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism
Data Source
AI summary
A micro device mass transfer equipment including a base stage, a moving stage, a substrate stage, a laser device, a rolling and pressing mechanism, and a heating mechanism is provided. The moving stage is movably disposed on the base stage, and moves with a moving path. The substrate stage is movably disposed on the base stage, and is adapted to move between different positions overlapping the moving stage. The laser device is movably disposed on the base stage. The laser device is adapted to move relative to the substrate stage, and emits a laser beam toward the substrate stage. The rolling and pressing mechanism is disposed on the moving path of the moving stage, and forms a contact region with the moving stage. The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism.