Micro-component Batch Transfer Pitch Mismatch Compensation

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Solution Overview

Problem

High-resolution display manufacturing faces challenges in batch-transfer processes due to pitch mismatch between substrates caused by different coefficients of thermal expansion, leading to improper transfer of micro/nano-sized components like microLEDs or sensors.

Innovation Solution

A system with actuators coupled to the transfer head and receiving substrate that can expand or contract in-plane to match the pitch of locations on both substrates, using thermal or mechanical actuators controlled by a computing device to monitor and adjust for pitch mismatch during the transfer process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If batch-transfer process is used for high-speed manufacturing, then productivity is improved, but pitch mismatch between substrates occurs due to different coefficients of thermal expansion

Engineering Contradiction:

Improvebatch-transfer speedVSAvoidpitch alignment

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the physical state of the substrates by controlling temperature to induce thermal expansion or contraction, thereby adjusting the pitch dimensions of the substrates to achieve alignment during batch-transfer processes

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent directly applies thermal expansion by heating or cooling the substrates to modify their dimensional characteristics, allowing the pitch of locations on different substrates to be matched despite different coefficients of thermal expansion

Inventive Principle:

Principle #37Thermal expansion

2Device complexity

If pitch mismatch is not compensated, then manufacturing process is simpler, but component transfer accuracy deteriorates

Engineering Contradiction:

Improveprocess complexityVSAvoidcomponent transfer accuracy

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent modifies temperature parameters of the substrates to achieve pitch matching, providing a relatively simple method compared to mechanical adjustment systems while maintaining high component transfer accuracy

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures proper alignment and transfer of components by compensating for thermal expansion differences, enhancing the efficiency and reliability of high-speed batch-transfer processes in display manufacturing.

Implementation Method 1

compensating for thermal expansion differences

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10923378B2Micro-component batch transfer systems, methods, and devices

Publication Date: 2021.02.16 SEAGATE TECH LLC

AI summary

A method for transferring components from a transfer head to a receiving substrate is disclosed. The method includes monitoring signals indicative of a pitch mismatch between locations on the transfer head and locations on the receiving substrate and actuating at least one actuator based at least in part on the monitored signals to reduce the mismatch of the pitch of the locations on the transfer head and the locations on the receiving substrate.