Micro-transfer Printable Electronic Component with Protruding Connection Posts
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Solution Overview
Problem
Existing methods for electrically interconnecting small integrated circuits or light-emitting diodes to destination substrates are costly and complex, requiring multiple processing steps and being prone to faults due to topographical differences between the components and substrates.
Innovation Solution
The use of micro-transfer printing with electrically conducting connection posts that protrude from the electronic components, which are forcefully driven into contact pads on the substrate to form a robust electrical connection, optionally with additional heat treatment or adhesive for enhanced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional assembly technologies are used to distribute electronically active components over substrates, then components can be placed on substrates, but the process is costly and complex with multiple processing steps
Solution Approach 1:
The invention divides the substrate into multiple sacrificial portions with anchor portions, allowing individual electronic components to be selectively released and transferred to specific locations. This segmentation enables simplified assembly by replacing complex traditional placement processes with a stamp-based transfer method that requires fewer processing steps.
Solution Approach 2:
The patent introduces a stamp as an intermediary tool that facilitates the transfer of electronic components from the substrate to designated locations. The stamp interacts with the released components and transfers them efficiently, eliminating the need for complex pick-and-place machinery and reducing overall process complexity.
2Reliability
If traditional assembly technologies are used, then components can be interconnected to substrates, but the process is prone to faults due to topographical differences
Solution Approach 1:
Instead of attempting to make components conform to the substrate surface, the invention inverts the approach by having connection posts protrude from the component side and be driven into the substrate. This inversion eliminates topographical mismatch issues and creates reliable electrical connections through a straightforward mechanical insertion process.
Solution Approach 2:
The patent employs parameter changes by applying heat or mechanical force to drive the connection posts into the substrate contact pads. This controlled application of energy parameters ensures reliable electrical contact while simplifying the interconnection process compared to traditional methods that require precise alignment and bonding procedures.
3Strength
If connection posts are driven into contact pads, then robust electrical connection is formed, but additional heat treatment or adhesive may be needed for enhanced adhesion
Solution Approach 1:
The connection posts are pre-formed on the electronic components before assembly, with their tips positioned to contact the substrate. This preliminary preparation allows the posts to be directly driven into contact pads during assembly, creating immediate mechanical and electrical connection without requiring subsequent adhesion steps.
Solution Approach 2:
The connection posts serve a dual function: they provide both electrical conduction and mechanical adhesion. As the posts are driven into the contact pads, they create their own anchoring effect through the mechanical insertion, eliminating the need for separate adhesive materials or complex bonding processes while ensuring robust electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the electrical interconnection process, reduces manufacturing costs, and minimizes faults by directly connecting the components to the substrate with fewer processing steps, ensuring reliable electrical contact.
Implementation Method 1
The connection posts, the contact pads, or both the connection posts and contact pads can be deformed or crumpled and the connection post can be driven into or through the backplane contact pad
Implementation Method 2
An additional heat treatment can be provided to facilitate the welding
Implementation Method 3
a layer of metal, for example a solder can be provided on either the surface of the connection post or the destination substrate contact pad, or both, that can be heated, causing the solder to reflow
Implementation Method 4
an adhesive can be provided on the destination substrate or electronic component to adhere the electronic component to the destination substrate
Data Source
AI summary
A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.