Micro-transfer Printed Compound Devices for Heterogeneous Integration
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Solution Overview
Problem
There is a challenge in integrating multiple heterogeneous components with different materials and processing resolutions into a common device at high density, as conventional methods are limited in size and cost-effectiveness.
Innovation Solution
The integration of compound micro-assembled devices using micro-transfer printing, where components with different native resolutions are assembled onto a common substrate with device interconnections, allowing for the use of various materials and processes, and forming fractured tethers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional pick-and-place technologies are used for assembling integrated circuits, then the circuits can be placed on a common substrate, but the size of the integrated circuits and their packaging becomes larger than desired
Solution Approach 1:
The patent divides the integrated circuit into smaller functional units called chiplets that can be independently processed and assembled. This segmentation allows each chiplet to be manufactured at optimal sizes for its specific function, reducing overall device size while maintaining ease of assembly through modular construction
Solution Approach 2:
The patent transitions from planar assembly to three-dimensional stacking, where chiplets are arranged in multiple layers vertically. This dimensional change enables higher integration density without increasing the footprint area, effectively reducing the overall device size while maintaining assembly feasibility
2Reliability
If different materials and processes are used for various components to improve performance, then component performance is enhanced, but integration complexity and costs increase
Solution Approach 1:
The patent employs a universal substrate platform that can accommodate multiple types of chiplets made from different materials (silicon, GaAs, InP, etc.). This universal platform provides standardized interfaces and processing steps, allowing diverse materials and processes to be integrated without proportionally increasing complexity
Solution Approach 2:
The patent performs preliminary processing of chiplets on their respective source wafers before assembly, including fabrication, testing, and packaging. This preliminary action allows each chiplet to be optimized for its specific material and process requirements independently, reducing the complexity of integrating different materials during final assembly
3Quantity of substance
If higher integration density is achieved through smaller component sizes, then device density improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an intermediary substrate or carrier wafer that holds multiple chiplets during fabrication and assembly processes. This intermediary provides a stable platform with standardized positioning features, enabling precise placement of small chiplets while simplifying the overall manufacturing process through batch processing
Solution Approach 2:
The patent uses master templates or stamp structures that define precise positions for chiplet placement. These copying mechanisms allow repeated, accurate positioning of chiplets at high density without requiring complex alignment procedures for each individual component
Data Source
AI summary
A compound micro-assembled device comprises a device substrate. A first component having a first native resolution and a second component having a second native resolution different from the first native resolution are both disposed on the device substrate. The device substrate can comprise a device circuit having a native resolution different from or less than the first and second native resolutions. One or more device interconnections electrically connect the first component to the second component or to the device circuit. In certain embodiments, the first component or the second component can be micro-transfer printed onto the device substrate. In certain embodiments, the compound micro-assembled device can be micro-transfer printed onto a destination substrate or the compound micro-assembled device can comprise a destination substrate onto which the device substrate is micro-transfer printed. At least one of the first component and second components and, optionally, the device substrate, comprises at least a portion of a tether.