Micro-Transfer Printed Device Repair via Connection Post Imprints
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Solution Overview
Problem
Current methods for transferring and connecting small integrated circuits (chiplets) to substrates are limited by material waste, high costs, and manufacturing variability, leading to reduced yields and increased expenses due to particulate contamination and defective components.
Innovation Solution
A micro-transfer printed system with contact pads and connection posts that allow for the physical and electrical connection of devices, enabling the removal and replacement of defective devices using a removal stamp, thereby ensuring robust and cost-effective electrical interconnections at high resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thin-film transistors are used to distribute electronically active circuits over substrates, then manufacturing cost is reduced and substrate area is increased, but performance is lower compared to mono-crystalline semiconductor circuits
Solution Approach 1:
The invention segments the substrate into multiple smaller sub- substrates, each containing mono-crystalline semiconductor circuits. This allows the system to achieve high performance through the use of superior mono-crystalline material while maintaining cost-effectiveness by processing smaller, manageable units rather than requiring a single large expensive substrate.
Solution Approach 2:
The invention changes the material parameter from thin-film semiconductor to mono-crystalline semiconductor, fundamentally improving circuit performance.同时, it changes the structural parameter by dividing the substrate into multiple smaller units, which affects both performance and manufacturing considerations.
2Reliability
If mono-crystalline semiconductor wafers are used as substrates, then circuit performance is improved, but substrate size is limited and cost is increased
Solution Approach 1:
The invention divides a large substrate area into multiple smaller sub-substrates, each made from mono-crystalline semiconductor wafers. This segmentation allows the system to achieve large total area by assembling multiple small high-performance units, overcoming the size limitation of individual mono-crystalline wafers while maintaining superior circuit performance.
3Ease of operation
If pick-and-place technologies are used to transfer integrated circuits to substrates, then device distribution is achieved, but integrated circuit size increases and packaging cost is increased
Solution Approach 1:
The invention performs preliminary action by forming connection posts and conducting materials on the sub-substrates before the transfer process. This preliminary preparation enables direct transfer of smaller active components without requiring large packaged integrated circuits, reducing the size of transferred objects and associated packaging costs while maintaining ease of transfer.
4Loss of substance
If transfer printing is used to distribute active components, then material utilization is improved and cost is reduced, but manufacturing variability increases leading to reduced yield
Solution Approach 1:
The invention segments the manufacturing process into separate stages: forming active components on source wafers, transferring them to sub-substrates, and then assembling sub-substrates into the final substrate. This segmentation isolates manufacturing variability to smaller units, allowing defect isolation and replacement of individual sub-substrates, thereby maintaining high yield despite transfer printing variability.
Solution Approach 2:
The invention enables discarding and recovering by allowing defective sub-substrates or individual components to be identified and replaced independently. When manufacturing variability produces defects, only the affected small sub-substrate or component needs to be discarded and replaced, rather than the entire large substrate, thus maintaining high overall manufacturing yield.
5Reliability
If contact pads are made larger to ensure electrical connection, then connection reliability is improved, but material waste is increased
Solution Approach 1:
The invention performs preliminary action by forming connection posts that extend from the active components before transfer. These pre-formed connection posts ensure reliable electrical connection upon transfer, eliminating the need for oversized contact pads and thereby reducing material waste while maintaining connection reliability.
Data Source
AI summary
A repaired transfer printed system (e.g., micro-transfer printed system) includes a system substrate having two or more contact pads disposed on the system substrate. One or more transfer printed devices (e.g., micro-transfer printed devices) are disposed in contact with the system substrate, each device having two or more connection posts. Each connection post of a replacement device is in physical contact with a contact pad, the connection post forming a second imprint in the physically contacted contact pad. In certain embodiments, a first imprint is in at least one of the physically contacted contact pads and is between the replacement device and the system substrate.