Micro-transfer printing volatile adhesive layer
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Solution Overview
Problem
Current micro-transfer printing methods face limitations in efficiency and yield, particularly in transferring small high-performance integrated circuits onto large substrates, with existing techniques requiring additional processing steps and equipment, and achieving reliable adhesion and electrical connections.
Innovation Solution
The method involves forming a volatile adhesive layer on a destination substrate, micro-transfer printing components onto this layer at a non-evaporable temperature, and then heating the adhesive to an evaporation temperature to evaporate it, which forms strong adhesion and electrical connections by melting and solidifying metal contacts, allowing for the diffusion of materials and formation of intermetallic bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional micro-transfer printing methods are used, then components can be transferred to large substrates, but the efficiency and yield of the transfer process are limited
Solution Approach 1:
A volatile adhesive layer is introduced as an intermediary between the component and destination substrate. This adhesive layer enables reliable transfer by providing temporary bonding during transfer, then can be selectively removed to release the component on the destination substrate, thereby improving both transfer efficiency and yield
Solution Approach 2:
The patent utilizes temperature as a control parameter to manage the volatile adhesive layer. By heating the system, the adhesive transitions from a bonded state to a removed state, enabling controlled release of components on the destination substrate. This parameter change approach improves transfer reliability and efficiency
2Reliability
If additional processing steps are added to improve adhesion and electrical connections, then connection quality improves, but process complexity and equipment requirements increase
Solution Approach 1:
The patent combines adhesion and electrical connection functions into a single integrated process. The volatile adhesive layer serves dual purposes: providing mechanical adhesion during transfer and enabling electrical contact through the metal contact melting process, thereby improving reliability without adding processing steps
Solution Approach 2:
The patent exploits phase transition of metal contacts from solid to liquid state during heating. This phase transition enables the metal contacts to flow and form strong adhesive bonds with the component contacts, simultaneously achieving both mechanical adhesion and electrical connection in one step
3Strength
If metal contacts are melted and solidified to form strong bonds, then adhesion and electrical connections improve, but the process requires precise temperature control
Solution Approach 1:
The volatile adhesive layer acts as a self-regulating mechanism. It is applied in excess and selectively remains in areas where components are present, automatically providing the necessary adhesive function without requiring precise spatial temperature control. The adhesive's volatility provides self-limiting behavior that reduces temperature control precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the adhesion and electrical connections between micro-transfer printed components and the destination substrate, improving the efficiency and yield of the micro-transfer printing process while reducing the need for additional processing steps and equipment.
Implementation Method 1
heating the volatile adhesive layer to an evaporation temperature to evaporate the volatile adhesive after micro-transfer printing
Implementation Method 2
heating an adhesive layer to an evaporation temperature causes at least a portion of each of one or more metal contacts to melt and enter a liquid or partially liquid state
Implementation Method 3
Cooling a metal contact to a temperature at which the any liquid present as a result of heating solidifies can adhere a component to a metal contact
Implementation Method 4
A material of a metal contact (e.g., a metal) diffuses into a component contact or a material (e.g., a metal) of a component contact diffuses into the metal contact, or both
Data Source
AI summary
A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.