Micro Vapor Chamber Lids for Localized Hotspot Cooling
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Solution Overview
Problem
Existing thermal management solutions for semiconductor devices are inadequate in efficiently addressing localized heat dissipation needs across diverse operational conditions, leading to excessive heat retention and thermal gradients that impact performance and reliability.
Innovation Solution
A multi-micro vapor chamber thermal management system is introduced, where each vapor chamber is customized for specific cooling requirements by tuning parameters such as dimensions, wick structure, and fluid composition independently for each region of the device, allowing efficient cooling of localized hotspots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single thermal management solution is used for the entire semiconductor device, then the device structure is simple and easy to manufacture, but it cannot efficiently address localized heat dissipation needs across diverse operational conditions
Solution Approach 1:
The thermal management system is divided into multiple independent micro vapor chambers, each covering specific regions of the semiconductor device. Each micro vapor chamber can be independently designed and optimized for the thermal characteristics of its covered region, enabling localized heat dissipation while maintaining manufacturing simplicity through modular construction
Solution Approach 2:
Each micro vapor chamber is customized with specific dimensions, wick structure configurations, and fluid compositions tailored to the local thermal requirements of different regions on the semiconductor device. This allows each region to have optimized thermal management properties matching its specific heat generation characteristics
2Reliability
If existing thermal management solutions are used, then the device structure remains simple, but excessive heat retention and thermal gradients occur leading to performance and reliability issues
Solution Approach 1:
By segmenting the cooling system into multiple micro vapor chambers targeting specific hotspots, the system effectively reduces thermal gradients and heat retention in critical regions, thereby improving device reliability without requiring a complete overhaul of the thermal management architecture
Solution Approach 2:
The micro vapor chambers utilize adjustable parameters including dimensions, wick structure properties, and fluid composition to optimize thermal performance. These parameter variations enable tailored thermal management for different regions, reducing thermal gradients and improving reliability while maintaining reasonable system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides efficient cooling across a broad operational range by customizing each micro vapor chamber for localized heat dissipation needs, reducing thermal resistance and enhancing the reliability and performance of semiconductor devices.
Implementation Method 1
A vapor chamber can be located adjacent to a portion of a device to be cooled, such as a hotspot. During operation, a working fluid is driven to a heated region of the chamber through capillary action within a porous wick structure where it evaporates
Implementation Method 2
spreads throughout the cavity in vapor form, and condenses on the opposing cold face of the chamber, i.e., a condenser
Implementation Method 3
a working fluid is driven to a heated region of the chamber through capillary action within a porous wick structure
Implementation Method 4
The condensed liquid is then recirculated to the heated area, allowing the cycle to be repeated
Data Source
AI summary
A thermal management system for an integrated circuit can include plural micro vapor chambers each configured to operate within their local environment. An exemplary system includes a semiconductor die, a first micro vapor chamber coupled with a first region of the semiconductor die, and a second micro vapor chamber coupled with a second region of the semiconductor die.