Micro-VCSEL Thermal Management With Metasurface Mirrors

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Solution Overview

Problem

Micro-VCSELs face thermal management challenges due to heat generation from current flowing through distributed Bragg reflectors, leading to shifting thresholds and reduced optical power, which causes data transmission errors, especially in dense arrays where thermal resistance increases significantly.

Innovation Solution

Implementing metasurface mirrors and integrated thermal management mechanisms, such as heat sinks, thermal vias, and liquid cooling channels, to dissipate heat efficiently, reducing the operating temperature and maintaining high performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If distributed Bragg reflectors are used in VCSELs to achieve lasing, then light reflection and lasing performance are improved, but heat generation increases causing threshold shifting and optical power reduction

Engineering Contradiction:
Improvelasing performanceVSAvoidoperating temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent extracts the thermal management function from the traditional VCSEL structure by integrating separate heat sink structures and thermal vias. The DBRs continue to perform their optical reflection function while the extracted thermal management components handle heat dissipation independently, resolving the contradiction between maintaining lasing performance and reducing operating temperature.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces thermal vias as intermediary structures between the VCSEL active region and the heat sink. These thermal vias act as mediators that conduct heat away from the VCSEL without interfering with the optical lasing process, allowing simultaneous achievement of stable lasing performance and controlled operating temperature.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If VCSEL density is increased for parallel data transfer, then data transmission capacity is improved, but thermal resistance increases significantly leading to degraded performance

Engineering Contradiction:
Improvedata transmission capacityVSAvoidperformance stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent segments the thermal management system into individual heat sink structures and thermal vias for each or groups of VCSELs in the dense array. This segmentation allows each VCSEL to have dedicated thermal pathways, preventing heat accumulation and maintaining performance stability even when VCSEL density is increased for higher data transmission capacity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent addresses thermal management in dense VCSEL arrays by adding vertical thermal management dimensions through integrated heat sinks and thermal vias extending beneath the VCSEL array. This dimensional approach to heat dissipation allows efficient thermal management in high-density configurations without compromising performance stability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If conventional thermal management is used, then simple structure is maintained, but heat dissipation is insufficient causing threshold shifting and data errors

Engineering Contradiction:
Improvestructure simplicityVSAvoiddata transmission accuracy
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent merges the optical lasing function and thermal management function into an integrated VCSEL structure. The DBRs perform optical reflection while integrated heat sinks and thermal vias handle heat dissipation simultaneously, achieving both adequate heat dissipation and data transmission accuracy without significantly increasing overall structural complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements multi-functional components where the VCSEL structure simultaneously performs optical lasing and thermal management functions. The integrated heat sinks and thermal vias serve dual purposes of structural support and heat dissipation, maintaining relative structural simplicity while ensuring data transmission accuracy through effective thermal management.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed thermal management solutions enable lower operating temperatures and higher performance in dense micro-VCSEL arrays, facilitating faster optical I/O speeds and extended operating temperature ranges.

Implementation Method 1

a VCSEL typically includes two distributed Bragg reflectors (DBRs) positioned above and below the active region where light is generated, thus reflecting light back and forth between the mirrors through the active region to achieve lasing

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

Current flowing through the DBRs generates heat

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 3

Implementing metasurface mirrors and integrated thermal management mechanisms, such as heat sinks, thermal vias, and liquid cooling channels, to dissipate heat efficiently

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20260005492A1Micro vertical-cavity surface-emitting laser (VCSEL) with integrated thermal management
Publication Date: 2026.01.01 INTEL CORP
  • US20260005492A1 patent drawing
  • US20260005492A1 patent drawing
  • US20260005492A1 patent drawing

AI summary

Devices and systems with lasers, such as vertical-cavity surface-emitting lasers (VCSELs), and methods of forming the same, are disclosed herein. In one example, a laser includes multiple mirrors and one or more quantum wells between the mirrors, where the mirrors include at least one metasurface mirror.